US3267007A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding metal deposits to electrically non-conductive material
Assignee: —
•
Filing: —
•
Granted: 1966-08-16
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Expires: 1983-08-16
Abstract
No abstract record available.
Inventors
No inventors recorded.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 20:30
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653; C23C18/18; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2073; C23C18/2086; C23C18/28; C23C18/30; H05K3/38; H05K3/381; H05K3/386; H05K3/387; H05K3/46; H05K3/4644; H05K3/4661
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
108 words
A METHOD OF BONDING A METAL DEPOSIT TO AN ELECTRICALLY NON-CONDUCTIVE BASE COMPRISING APPLYING TO A SURFACE OF SAID BASE AN ADHESIVE COATING COMPOSITION COMPRISING A CURABLE THERMOSETTING RESIN IN A VAPORIZABLE SOLVENT, THE RESIN BEING IN THE A STAGE AND REQUIRING THE APPLICATION OF HEAT FOR CURING TO THE STAGE, SUBJECTING THE ADHESIVE COATING TO VACUUM DRYING TO REMOVE ALL OF THE SOLVENT, THE TEMPERATURE OF VACUUM DRYING BEING SUFFICIENTLY LOW TO PREVENT CURING OF THE RESIN OF THE ADHESIVE COATING, DEPOSITING METAL ON THE SOLVENT-FREE, UNCURED ADHESIVE COATING, AND THEN CURING THE RESIN OF THE ADHESIVE COATING DIRECTLY FROM THE A STAGE TO THE C STAGE.
Claim 2
Independent Claim
108 words
A METHOD OF BONDING A METAL DEPOSIT TO AN ELECTRICALLY NON-CONDUCTIVE BASE COMPRISING APPLYING TO A SURFACE OF SAID BASE AN ADHESIVE COATING COMPOSITION COMPRISING A CURABLE THERMOSETTING RESIN IN A VAPORIZABLE SOLVENT, THE RESIN BEING IN THE A STAGE AND REQUIRING THE APPLICATION OF HEAT FOR CURING TO THE STAGE, SUBJECTING THE ADHESIVE COATING TO VACUUM DRYING TO REMOVE ALL OF THE SOLVENT, THE TEMPERATURE OF VACUUM DRYING BEING SUFFICIENTLY LOW TO PREVENT CURING OF THE RESIN OF THE ADHESIVE COATING, DEPOSITING METAL ON THE SOLVENT-FREE, UNCURED ADHESIVE COATING, AND THEN CURING THE RESIN OF THE ADHESIVE COATING DIRECTLY FROM THE A STAGE TO THE C STAGE.
Claim 3
Independent Claim
145 words
A METHOD OF MAKING PRINTED CIRCUITS COMPRISING PROVIDING A PLASTIC, ELECTRICALLY NON-CONDUCTIVE BOARD, APPLYING TO A SURFACE OF SAID BOARD AN ADHESIVE COATING COMPRISING A CURABLE, THERMOSETTING RESIN IN A VAPORIZABLE SOLVENT, THE RESIN BEING IN THE A STAGE AND REQUIRING THE APPLICATION OF HEAT FOR CURING TO THE C STAGE, SUBJECTING THE ADHESIVE COATNG TO VACUUM DRYING TO REMOVE ALL OF THE SOLVENT, THE TEMPERATURE OF VACUUM DRYING BEING SUFFICIENTLY LOW TO PREVENT CURING OF THE RESIN OF THE ADHESIVE COATING, DEPOSITING A CONDUCTIVE METAL ON THE DRY, SOLVENT-FREE, UNCURED ADHESIVE COATING, THEN CURING THE RESIN OF THE ADHESIVE COATING DIRECTLY FROM THE A STAGE TO THE C STAGE, APPLYING A PLATING RESIST TO THE METAL DEPOSIT IN THE REVERSE OF THE DESIRED CIRCUIT PATTERN, PLASTING THE EXPOSED METAL RUNS, REMOVING THE RESIST, AND REMOVING THE METAL LEFT EXPOSED BY REMOVAL OF THE RESIST.
Claim 4
Independent Claim
145 words
A METHOD OF MAKING PRINTED CIRCUITS COMPRISING PROVIDING A PLASTIC, ELECTRICALLY NON-CONDUCTIVE BOARD, APPLYING TO A SURFACE OF SAID BOARD AN ADHESIVE COATING COMPRISING A CURABLE, THERMOSETTING RESIN IN A VAPORIZABLE SOLVENT, THE RESIN BEING IN THE A STAGE AND REQUIRING THE APPLICATION OF HEAT FOR CURING TO THE C STAGE, SUBJECTING THE ADHESIVE COATNG TO VACUUM DRYING TO REMOVE ALL OF THE SOLVENT, THE TEMPERATURE OF VACUUM DRYING BEING SUFFICIENTLY LOW TO PREVENT CURING OF THE RESIN OF THE ADHESIVE COATING, DEPOSITING A CONDUCTIVE METAL ON THE DRY, SOLVENT-FREE, UNCURED ADHESIVE COATING, THEN CURING THE RESIN OF THE ADHESIVE COATING DIRECTLY FROM THE A STAGE TO THE C STAGE, APPLYING A PLATING RESIST TO THE METAL DEPOSIT IN THE REVERSE OF THE DESIRED CIRCUIT PATTERN, PLASTING THE EXPOSED METAL RUNS, REMOVING THE RESIST, AND REMOVING THE METAL LEFT EXPOSED BY REMOVAL OF THE RESIST.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-08-15 | 1970-02-14 | 1970-08-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-08-15 | 1974-02-14 | 1974-08-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-08-15 | 1978-02-14 | 1978-08-16 | $7700.00 | Window Closed / Lapsed |