US3256586A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Welded circuit board technique
Assignee: U S ENGINEERING CO Inc
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Filing: 1962-01-04
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Granted: 1966-06-21
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Expires: 1982-01-04
Abstract
No abstract record available.
Inventors
- 👤 Richard R Douglas
- 👤 William G Reimann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 01:58
CPC Classifications
C; C25; C25D; C25D1/00; C25D5/00; C25D5/02; H; H05; H05K; H05K3/00; H05K3/10; H05K3/20; H05K3/205; H05K3/40; H05K3/4092; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0367; H05K3/30; H05K3/32; H05K3/328; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49128
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
65 words
A PROCESS FOR MAKING A WELDABLE PRINTED CIRCUIT BOARD COMPRISING THE STEPS OF: PREPARING AN APERTURED REMOVABLE ELECTROPLASTING FORM, ELECTROPLASTING TUBES THROUGH THE APERTURES OF SAID FORM AND ELECTROPLATING STRIPS INTERCONNECTING SELECTED TUBES ON ONE SURFACE OF SAID FORM, SECURING A PRINTED CIRCUIT BOARD BASE MEMBER TO THE ELECTROPLATED CONDUCTIVE MATERIAL, AND REMOVING SAID FORM FROM THE ELECTROPLATED MATERIAL AND THE CIRCUIT BOARD BASE MEMBER.
Claim 2
Dependent Claim
65 words
A PROCESS FOR MAKING A WELDABLE PRINTED CIRCUIT BOARD COMPRISING THE STEPS OF: PREPARING AN APERTURED REMOVABLE ELECTROPLASTING FORM, ELECTROPLASTING TUBES THROUGH THE APERTURES OF SAID FORM AND ELECTROPLATING STRIPS INTERCONNECTING SELECTED TUBES ON ONE SURFACE OF SAID FORM, SECURING A PRINTED CIRCUIT BOARD BASE MEMBER TO THE ELECTROPLATED CONDUCTIVE MATERIAL, AND REMOVING SAID FORM FROM THE ELECTROPLATED MATERIAL AND THE CIRCUIT BOARD BASE MEMBER.
Claim 3
Dependent Claim
105 words
A PROCESS FOR MAKING A WELDABLE CIRCUIT BOARD COMPRISING THE STEPS OF: PREPARING A MOLD HAVING A FLAT SURFACE AND PEGS EXTENDING INTO SAID MOLD FROM SAID SURFACE, POURING HARDENABLE MATERIAL INTO SAID MOLD, REMOVING THE RESULTANT MOLDED ELECTROPLATING FORM, FROM THE MOLD AFTER THE MATERIAL HAS HARDENED, COATING PORTIONS OF SAID FORM WITH AN ELECTROPLATING RESIST MATERIAL, ELECTROPLATING TUBES OF CONDUCTIVE MATERIAL THROUGH THE APERTURES IN SAID FORM, AND ELECTROPLATING STRIPS ON THE FORM TO INTERCONNECT SELECTGED TUBES, SECURING A PRINTED CIRCUIT BOARD BASE MEMBER TO THE ELECTROPLATED CONDUCTIVE MATERIAL, AND REMOVING SAID FORM FROM THE ELECTROPLATED MATERIAL AND THE CIRCUIT BOARD BASE MEMBER.
Claim 4
Dependent Claim
105 words
A PROCESS FOR MAKING A WELDABLE CIRCUIT BOARD COMPRISING THE STEPS OF: PREPARING A MOLD HAVING A FLAT SURFACE AND PEGS EXTENDING INTO SAID MOLD FROM SAID SURFACE, POURING HARDENABLE MATERIAL INTO SAID MOLD, REMOVING THE RESULTANT MOLDED ELECTROPLATING FORM, FROM THE MOLD AFTER THE MATERIAL HAS HARDENED, COATING PORTIONS OF SAID FORM WITH AN ELECTROPLATING RESIST MATERIAL, ELECTROPLATING TUBES OF CONDUCTIVE MATERIAL THROUGH THE APERTURES IN SAID FORM, AND ELECTROPLATING STRIPS ON THE FORM TO INTERCONNECT SELECTGED TUBES, SECURING A PRINTED CIRCUIT BOARD BASE MEMBER TO THE ELECTROPLATED CONDUCTIVE MATERIAL, AND REMOVING SAID FORM FROM THE ELECTROPLATED MATERIAL AND THE CIRCUIT BOARD BASE MEMBER.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-06-20 | 1969-12-20 | 1970-06-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-06-20 | 1973-12-20 | 1974-06-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-06-20 | 1977-12-20 | 1978-06-21 | $7700.00 | Window Closed / Lapsed |