Patent JPS5313473A successfully refreshed from Google Patents.
US3244939A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated die bonded hybrid integrated circuit
Assignee: International Standard Electric Corp
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Filing: 1963-04-15
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Granted: 1966-04-05
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Expires: 1983-04-15
Abstract
No abstract record available.
Inventors
- 👤 Sandbank Carl Peter
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 16:23
CPC Classifications
H; H10; H10W; H10W99/00; H01; H01R; H01R13/00; H01R13/66; H01R13/719; H10D; H10D48/00; H10D48/30; H10D48/32; H10D48/34; H10D48/345; H10D84/00; H10D84/60; H10D84/611; H10D84/613; H10D84/617; H10D99/00; H10P; H10P95/00; H10W15/00; H10W15/01; H10W20/00; H10W20/40; H10W70/00; H10W70/40; H10W70/479; H10W74/00; H10W74/01; H10W74/40; H10W74/43; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
142 words
A SEMICONDUCTOR ARRANGEMENT COMPRISING A THIN INSULATING PLATE ON WHICH PLATE ARE DEPOSITED A NUMBER OF AREAS OF THIN METALLIC FILM, AND ON WHICH PLATE TWO OR MORE SEMICONDUCTOR DIES ARE MOUNTED AND ENCAPSULATED, EACH SEMICONDUCTOR DIE CONTAINING ONE ACTIVE CIRCUIT ELEMENT WITH ONE ELECTRODE AT A PLANE SURFACE WHICH FORMS ONE FACE OF THE SEMICONDUCTOR DIE WHILE AT LEAST ONE OTHER ELECTRODE IS AT ANOTHER FACE OF THE SURFACE OF THE DIE, EACH SAID SEMICONDUCTOR DIE HAVING SAID PLANE SURFACE JOINED TO A SEPARATE AREA OF SAID THIN METALLIC FLIM WITH THE OTHER ELECTRODE BEING CONNECTED BY A THIN WIRE TO OTHER CONNECTION POINTS, AND THE SEMICONDUCTOR DIES AND THE THIN WIRES BEING SEALED BY A DEPOSITED MASS OF HARDENABLE PLASTICS MATERIAL ON THE THIN INSULATING PLATE TO COVER COMPLETELY SAID SEMICONDUCTOR DIES, SAID PLATE FORMING ONE WALL OF SAID SEAL.
Claim 2
Dependent Claim
142 words
A SEMICONDUCTOR ARRANGEMENT COMPRISING A THIN INSULATING PLATE ON WHICH PLATE ARE DEPOSITED A NUMBER OF AREAS OF THIN METALLIC FILM, AND ON WHICH PLATE TWO OR MORE SEMICONDUCTOR DIES ARE MOUNTED AND ENCAPSULATED, EACH SEMICONDUCTOR DIE CONTAINING ONE ACTIVE CIRCUIT ELEMENT WITH ONE ELECTRODE AT A PLANE SURFACE WHICH FORMS ONE FACE OF THE SEMICONDUCTOR DIE WHILE AT LEAST ONE OTHER ELECTRODE IS AT ANOTHER FACE OF THE SURFACE OF THE DIE, EACH SAID SEMICONDUCTOR DIE HAVING SAID PLANE SURFACE JOINED TO A SEPARATE AREA OF SAID THIN METALLIC FLIM WITH THE OTHER ELECTRODE BEING CONNECTED BY A THIN WIRE TO OTHER CONNECTION POINTS, AND THE SEMICONDUCTOR DIES AND THE THIN WIRES BEING SEALED BY A DEPOSITED MASS OF HARDENABLE PLASTICS MATERIAL ON THE THIN INSULATING PLATE TO COVER COMPLETELY SAID SEMICONDUCTOR DIES, SAID PLATE FORMING ONE WALL OF SAID SEAL.
References Cited (Backward Citations)
US3072832A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-04-04 | 1969-10-04 | 1970-04-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-04-04 | 1973-10-04 | 1974-04-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-04-04 | 1977-10-04 | 1978-04-05 | $7700.00 | Window Closed / Lapsed |