US3234060A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of fabricating a laminated printed circuit structure
Assignee: Unisys Corp
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Filing: 1961-06-15
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Granted: 1966-02-08
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Expires: 1981-06-15
Abstract
No abstract record available.
Inventors
- 👤 Casement James
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 23:53
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0759
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
156 words
THE METHOD OF FABRICATING A LAMINATED PRINTED CIRCUIT STRUCTURE WHICH COMPRISES THE STEPS OF (A) COATING ONE MAJOR SURFACE OF FIRST AND SECOND CONDUCTOR BLANKS WITH A THIN FILM OF A CERTAIN INSULATING ADHESIVE LAYER, (B) PLACING SAID CONDUCTOR BLANKS TOGETHER WITH SAID ADHESIVE COATED SURFACES IN CONTACT, (C) CURING SAID CERTAIN ADHESIVE TO A MECHANICALLY RIGID FILM THEREBH BONDING SAID FIRST AND SECOND CONDUCTOR BLANKS ALONG SAID MAJOR SURFACES TO FORM A FIRST THIN LAMINATE ASSEMBLY, (D) FORMING A CIRCUIT PATTERN IN SAID FIRST BLANK, (E) COATING THE SURFACE OF THE CIRCUIT PATTERN FORMED FROM SAID FIRST BLANK WITH A SECOND LAYER OF SAID CERTAIN INSULATING ADHESIVE, (F) PLACING A THIRD CONDUCTIVE BLANK IN CONTACT WITH SAID SECOND LAYER OF ADHESIVE, (G) CURING SAID SECOND ADHESIVE LAYER TO FORM A RIGID MECHANICAL FILM THEREBY BONDING SAID THIRD CONDUCTIVE BLANK TO SAID FIRST LAMINATE ASSEMBLY AND THENCE (H) ETCHING CIRCUIT PATTERNS IN THE OUTER CONDUCTIVE BLANKS.
Claim 2
Independent Claim
156 words
THE METHOD OF FABRICATING A LAMINATED PRINTED CIRCUIT STRUCTURE WHICH COMPRISES THE STEPS OF (A) COATING ONE MAJOR SURFACE OF FIRST AND SECOND CONDUCTOR BLANKS WITH A THIN FILM OF A CERTAIN INSULATING ADHESIVE LAYER, (B) PLACING SAID CONDUCTOR BLANKS TOGETHER WITH SAID ADHESIVE COATED SURFACES IN CONTACT, (C) CURING SAID CERTAIN ADHESIVE TO A MECHANICALLY RIGID FILM THEREBH BONDING SAID FIRST AND SECOND CONDUCTOR BLANKS ALONG SAID MAJOR SURFACES TO FORM A FIRST THIN LAMINATE ASSEMBLY, (D) FORMING A CIRCUIT PATTERN IN SAID FIRST BLANK, (E) COATING THE SURFACE OF THE CIRCUIT PATTERN FORMED FROM SAID FIRST BLANK WITH A SECOND LAYER OF SAID CERTAIN INSULATING ADHESIVE, (F) PLACING A THIRD CONDUCTIVE BLANK IN CONTACT WITH SAID SECOND LAYER OF ADHESIVE, (G) CURING SAID SECOND ADHESIVE LAYER TO FORM A RIGID MECHANICAL FILM THEREBY BONDING SAID THIRD CONDUCTIVE BLANK TO SAID FIRST LAMINATE ASSEMBLY AND THENCE (H) ETCHING CIRCUIT PATTERNS IN THE OUTER CONDUCTIVE BLANKS.
References Cited (Backward Citations)
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US3006795A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-02-07 | 1969-08-09 | 1970-02-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-02-07 | 1973-08-09 | 1974-02-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-02-07 | 1977-08-09 | 1978-02-08 | $7700.00 | Window Closed / Lapsed |