US3226804A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of soldering peltier devices
Assignee: US Philips Corp
•
Filing: 1963-03-12
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Granted: 1966-01-04
•
Expires: 1983-03-12
Abstract
No abstract record available.
Inventors
- 👤 Hasenclever Werner
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:41
CPC Classifications
B; B23; B23K; B23K1/00; F; F25; F25B; F25B21/00; F25B21/02; H; H10; H10N; H10N10/00; H10N10/80; H10N10/81; H10N10/817; B23K2101/00; B23K2101/36; B23K2101/40; F25B2321/00; F25B2321/02; F25B2321/023
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
145 words
A METHOD OF MANUFACTURING A PELTIER DEVICE COMPRISING THE STEPS OF SOLDERING ALTERNATIVELY P- AND N-TYPE SEMI-CONDUCTOR BODIES TO RELATIVELY NARROW CURRENT BRIDGES SECURED TO AND INSULATED FROM A BASE PLATE, COATING EACH OF THE UPPER SURFACES OF SAID SEMI-CONDUCTOR BODIES WITH A SOLID SOLDERING MATERIAL, LOOSELY DISPOSING UPPER CURRENT BRIDGES ON SAID SOLDERING MATERIAL, SAID SOLDERING MATERIAL BEING EMPLOYED ON AN AMOUNT TO PREVENT SHORTING BETWEEN SAID UPPER CURRENT BRIDGES, MELTING THE SOLDER AND PRESSING SAID LOOSELY DISPERSED UPPER CURRENT BRIDGES INTO THE MOLTEN SOLDER BY MEANS OF A COVER PLATE PRESSING DOWN UPON SAID LOOSELY DISPERSED CURRENT BRIDGES TO CONFORM UPPER SURFACES OF SAID LOOSELYDISPERSED BRIDGES TO THE LOWER SURFACE OF THE COVER PLATE, ALLOWING THE MOLTEN SOLDER TO COOL AND SOLIDIFY THUS SOLDERING THE UPPER CURRENT BRIDGES TO THE SEMI-CONDUCTOR BODIES AND THEN FASTENING THE COVER PLATE TO THE UPPER CURRENT BRIDGES.
Claim 2
Independent Claim
145 words
A METHOD OF MANUFACTURING A PELTIER DEVICE COMPRISING THE STEPS OF SOLDERING ALTERNATIVELY P- AND N-TYPE SEMI-CONDUCTOR BODIES TO RELATIVELY NARROW CURRENT BRIDGES SECURED TO AND INSULATED FROM A BASE PLATE, COATING EACH OF THE UPPER SURFACES OF SAID SEMI-CONDUCTOR BODIES WITH A SOLID SOLDERING MATERIAL, LOOSELY DISPOSING UPPER CURRENT BRIDGES ON SAID SOLDERING MATERIAL, SAID SOLDERING MATERIAL BEING EMPLOYED ON AN AMOUNT TO PREVENT SHORTING BETWEEN SAID UPPER CURRENT BRIDGES, MELTING THE SOLDER AND PRESSING SAID LOOSELY DISPERSED UPPER CURRENT BRIDGES INTO THE MOLTEN SOLDER BY MEANS OF A COVER PLATE PRESSING DOWN UPON SAID LOOSELY DISPERSED CURRENT BRIDGES TO CONFORM UPPER SURFACES OF SAID LOOSELYDISPERSED BRIDGES TO THE LOWER SURFACE OF THE COVER PLATE, ALLOWING THE MOLTEN SOLDER TO COOL AND SOLIDIFY THUS SOLDERING THE UPPER CURRENT BRIDGES TO THE SEMI-CONDUCTOR BODIES AND THEN FASTENING THE COVER PLATE TO THE UPPER CURRENT BRIDGES.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1969-01-03 | 1969-07-05 | 1970-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1973-01-03 | 1973-07-05 | 1974-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1977-01-03 | 1977-07-05 | 1978-01-04 | $7700.00 | Window Closed / Lapsed |