Method of making printed circuits

Claim 1

A PROCESS FOR FORMING PRINTED CIRCUITS WHICH COMPRISES PROVIDING AN INSULATING BASE HAVING SURFACE PORTIONS CONSISTING ESSENTIALLY OF AN ADHESIVE RESINOUS BONDING COMPOSITION HAVING DISPERSED THEREIN AT NUMEROUS INDIVIDUAL SITES SOLID, FINELY DIVIDED, DISCRETE PARTICLES OF A CATALYTIC AGENT SELECTED FROM THE GROUP CONSISTING OF TITANIUM, ALUMINUM, COPPER, IRON, COBALT, LZINC, TITANIUM OXIDE, COPPER OXIDE AND MIXTURES OF THE FOREGOING, SAID RESINOUS BONDING COMPOSITION FURTHER COMPRISING, IN COMBINATION, A THERMOSETTING RESIN AND A FLEXIBLE ADHESIVE RESIN, THE FLEXIBLE ADHESIVE RESIN HAVING APPENDED THERETO A POLAR GROUP WHICH IS A MEMBER SELECTED FROM THE GROUP CONSISTING OF NITRILE, EXPXIDE, ACETAL, CHLORIDE AND HYDROXYL GROUPS, CURING THE ADHESIVE RESINOUS BONDING COMPOSITION TO FIRMLY ADHERE THE FINELY DIVIDED PARTICLES OF SAID MEMBER TO THE BASE, WHILE RETAINING THE DICRETENESS OF THE PARTICLES AND THEIR PRESENCE AT NUMEROUS INDIVIDUAL SITES, AND TREATING THE RESULTING BASE WITH AN ELECTROLESS METAL DEPOSITION BATH TO ADHERENTLY DEPOSIT ELECTROLESS METAL DIRECTLY ON THE CURED ADHESIVE RESINOUS BONDING COMPOSITION SO AS TO FORM A CONDUCTING PATTERN.