Method for capacitor fabrication

Claim 1

IN A METHOD OF FABRICATING ENCAPSULATED ELECTRICAL COMPONENTS HAVING A GENERALLY CYLINDRICALLY SHAPED BODY PORTION WITH TERMINAL LEADS EXTENDING THEREFROM, THE STEPS OF POSITIONING THE BODY PORTION OF AN UNENCAPSULATED COMPONENT IN SPACED RELATION TO A CYLINDRICALLY SHAPED MOLD CAVITY AND THE EXTENDING TERMINAL LEADS THEREOF RELATIVE TO THE CAVITY DEFINING MOLD WALLS BY INTERPOSITION OF AN END WALLED TERMINAL LEAD POSITIONING SEMI-CYLINDRICALLY-SHAPED INSULATING MEANS INTERMEDIATE SAID COMPONENT AND THE MOLD CAVITY SURFACES OF A THICKNESS AT LEAST EQUAL TO THE MINIMAL DESIRED DEPTH OF ENCAPSULATION, CLOSING SAID MOLD CAVITY BY SUPERPOSITION OF A COMPLEMENTALLY SHAPED MOLD CAVITY THEREOVER AND INTRODUCING COMPATIBLE LIQUID THERMOPLASTIC ENCASING MATERIAL INTO SAID CLOSED MOLD TO FILL ALL VOIDS THEREWITHIN AND TO MERGE, UPON SOLIDIFICATION THEREOF, WITH SAID INSULATING MEANS TO FORM A UNITARY ENCLOSED CASING HAVING SAID COMPONENT SUBSTANTIALLY UNIFORMLY CENTERED THEREWITHIN.