Method of making an encapsulated impedance element

Claim 1

THE PROCESS FOR FORMING AN ENCAPSULATED RESISTOR COMPRISING THE STEPS OF FORMING A RESISTOR BLANK OF A PREDETERMINED VALUE, FORMING A PAIR OF TERMINAL LEADS PLACING A PORTION OF ONE OF SAID LEADS IN CONTACT WITH EACH END RESPECTIVELY OF SAID RESISTANCE BLANK, DISPOSING A SLEEVE OF FUSIBLE ENCAPSULATING MATERIAL ABOUT SAID RESISTANCE BLANK AND THE CONTACTING PORITONS OF SAID TERMINAL LEADS IN A SPACED RELATIONSHIP THEREWITH, PROVIDING EACH SAID TERMINAL LEAD WITH AN ADHERENT FUSIBLE ELEMENT DISPOSED ABOUT SAID LEADS INTERMEDIATE THE ENDS THEREOF HAVING A COEFFICIENT OF THERMAL EXPANSION SIMILAR TO SAID ENCAPSULATING SLEEVE MATERIAL, THERMALLY SEALING SAID RESISTANCE BLANK WITHIN SAID ENCAPSULATING SLEEVE ONLY AT SAID FUSIBLE ELEMENTS, AND SIMULTANEOUSLY FUSIBLY UNITING EACH OF SAID TERMINAL LEAD CONTACTING PORTIONS TO SAID RESISTOR BLANK ENDS SUBSTANTIALLY WITH HEAT CONDUCTED THROUGH SAID TERMINAL LEADS WITHOUT DELETERIOUSLY AFFECTING THE ELECTRICAL PROPERTIES OF SAID RESISTOR.