Semiconductor devices

Claim 1

A SEMICONDUCTOR DEVICE COMPRISING AN ELECTRICALLY AND THERMALLY CONDUCTIVE CYLINDRICAL SHELL HAVING A SUPPORT PORTION AT THE LOWER END THEREOF AND A PERIPHERAL FLANGE AT THE UPPER END THEREOF; A SEMICONDUCTOR MEMBER DIRECTLY JOINED TO THE UPPER SURFACE OF THE SUPPORT PORTION WITHIN THE CYLINDRICAL SHELL SO THAT HEAT MAY BE DISSIPATED THEREFROM TO THE SUPPORT; A GOOD ELECTRICALLY AND THERMALLY CONDUCTIVE DISK OF AN AREA LARGER THAN THE SEMICONDUCTOR MEMBER JOINED TO THE UPPER SURFACE OF THE SEMICONDUCTOR MEMBER TO DISTRIBUTE EVENLY THEREON THERMAL, ELECTRICAL AND MECHANICAL LOADS AND TO ACT AS A HEAT SINK AND TO DISSIPATE SURGE CURRENTS; AN INSULATING SLEEVE DISPOSED IN THE SHELL AND CONFORMING TO THE INNER CIRCUMFERENCE THEREOF; AN INSULATING CLOSURE HAVING A METAL RING JOINED TO ITS OUTER PERIPHERY AND HAVING AN ELECTRICAL CONDUCTOR SEALED THEREIN AND PASSING THERETHROUGH HERMETICALLY JOINED TO AND CLOSING THE OPEN END OF THE CYLINDRICAL SHELL AND THE ELECTRICAL CONDUCTOR BEING SOLDERED TO THE ELECTRICALLY AND THERMALLY CONDUCTIVE DISK.