Sealed electrical devices

Claim 1

IN COMBINATION WITH A SEMICONDUCTOR DEVICE COMPRISING A SEMICONDUCTOR MEMBER, AT LEAST ONE ELECTRODE CONTACT ON A MAJOR SURFACE OF THE MEMBER, AN ELECTRICALLY CONDUCTING HEAT DISSIPATING BASE FOR THE ASSEMBLY OF ELECTRODE CONTACTS AND SEMICONDUCTOR MEMBER, AND A TUBULAR HOUSING ENCLOSING THE ASSEMBLY, THE IMPROVEMENT COMPRISING A PORTION OF REDUCED WALL THICKNESS EXTENDING FROM THE LOWER END OF THE HOUSING WHICH AT ITS JUNCTION WITH THE REMAINDER OF THE HOUSING PROVIDES A SHOULDER TERMINATING ON THE INTERIOR WALL OF THE HOUSING IN AN ANNULAR KNIFE-EDGE DIRECTED TOWARD ONE END THEREOF, THE BASE BEING DISPOSED WITHIN THE LOWER END OF THE HOUSING AT THE REDUCED WALL THICKNESS PORTION AND ABUTTING THE KNIFE EDGE, A SECTION OF THE PORTION OF REDUCED WALL THICKNESS HAVING BEEN SWAGED OVER THE LOWER END OF THE BASE TO FIRMLY SECURE THE BASE BETWEEN SAID KNIFE EDGE AND SAID SWAGED SECTION TO PROVIDE A FIRM MOUNTING FOR THE SEMICONDUCTOR MEMBER.