Methods of making printed circuit components

Claim 1

THE METHOD OF MAKING THIN-FILM CIRCUIT COMPONENTS AND ATTACHING LEADS THERETO WHICH COMPRISES THE STEPS OF: SUCCESSIVELY APPLYING A GOLD FILM TO THOSE SURFACE AREAS OF A GLASS SUBSTRATE ON WHICH NO COMPONENT IS DESIRED; DEPOSITING A THIN LAYER OF A FILM-FORMING METAL SELECTED FROM THE GROUP CONSISTING OF ZIRCONIUM, TANTALUM, TITANIUM, AND NIOBIUM ON EXPOSED AREAS OF THE SUBSTRATE AND THE GOLD FILM; MASKING WITH A RESIST THOSE AREAS OF THE FILM-FORMING METAL ON WHICH A LEAD IS TO BE ATTACHED; IMMERSING THE SUBSTRATE HAVING THE GOLD, FILM-FORMING METAL AND RESIST THEREON IN A BATH OF AQUA REGIA ACID, CAUSING THE ACID TODIFFUSE THROUGH THE FILM-FORMING METAL NOT PROTECTED BY THE RESIST, TO ATTACK THE GOLD UNDERLYING SAID FILM-FORMING METAL AND TO REMOVE SAID GOLD AND THE OVERLYING FILM-FORMING METAL; REMOVING THE RESIST FROMTHE FILM-FORMING METAL; AND ATTACHING A LEAD TO THE FILM-FORMING METAL OVERLYING SAID GOLD FILM.