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US3203083A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing a hermetically sealed semiconductor capsule

Assignee: Texas Instruments Inc
•
Filing: 1961-02-08
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Granted: 1965-08-31
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Expires: 1981-02-08
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Abstract

No abstract record available.

Inventors

  • 👤 Robert E Obenhaus

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-24 23:49
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/16; H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/161

Claims Analysis

Total Claims: 4
Claim 1
Independent Claim 120 words
THE METHOD OF MANUFACTURING A HERMETICALLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, EACH OF SAID HARD METAL FLANGES BEING FORMED WITH A COMPARATIVELY SOFT FACE-FORMING METAL METALLURGICALLY PREBONDED THEREON, ONE OF SAID FLANGES HAVING FORMED IN ITS SOFT METAL FACE A CIRCUMFERENTIAL PROTRUSION AND THE OTHER FLANGE BEING FORMED IN ITS SOFT METAL FACE WITH A NONGROOVED PORTION FOR ENGAGEMENT BY SAID PROTRUSION, BRINGING SAID HARD FLANGES TOGETHER WITH SAID PREBONDED SOFT METAL THEREBETWEEN, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO DEFORM THE PROTRUSION TO EFFECT A SOLID-PHASE BOND AT LEAST IN THE REGION OF THE PROTRUSION.
Claim 2
Independent Claim 120 words
THE METHOD OF MANUFACTURING A HERMETICALLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, EACH OF SAID HARD METAL FLANGES BEING FORMED WITH A COMPARATIVELY SOFT FACE-FORMING METAL METALLURGICALLY PREBONDED THEREON, ONE OF SAID FLANGES HAVING FORMED IN ITS SOFT METAL FACE A CIRCUMFERENTIAL PROTRUSION AND THE OTHER FLANGE BEING FORMED IN ITS SOFT METAL FACE WITH A NONGROOVED PORTION FOR ENGAGEMENT BY SAID PROTRUSION, BRINGING SAID HARD FLANGES TOGETHER WITH SAID PREBONDED SOFT METAL THEREBETWEEN, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO DEFORM THE PROTRUSION TO EFFECT A SOLID-PHASE BOND AT LEAST IN THE REGION OF THE PROTRUSION.
Claim 3
Independent Claim 145 words
THE METHOD OF MANUFACTURING A HERMETICLLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, ONE OF SAID FLANGES HAVING A CIRCUMFERENTIAL PROTRUSION EXTENDING FROM ITS INNER FACE, THE OTHER FLANGE BEING FORMED WITH AN INNER NONGROOVED PORTION OPPOSITE SAID PROTRUSION, AT LEAST ONE OF SAID FLANGES BENG FORMED WITH AN INNER METALLURGICALLY PREBONDED COMPARATIVELY SOFT METAL FACING IN A POSITION TO BE SQUEEZED BY THE PROTRUSION WHEN THE FLANGES ARE PUSHED TOGETHER, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO SQUEEZE SAID SOFT METAL FACING BE TWEEN THE PROTRUSION ON THE ONE FLANGE AND THE NONGROOVED PORTION ON THE OTHER FLANGE TO SOLID-PHASE BOND THE SOFT METAL TO EFFECT A STRONG HERMETICALLY SEALED CONNECTION BETWEEN THE FLANGES AT LEAST IN THE REGION OF THE PROTRUSION.
Claim 4
Independent Claim 145 words
THE METHOD OF MANUFACTURING A HERMETICLLY SEALED SEMICONDUCTOR CAPSULE OR THE LIKE, COMPRISING FORMING SPACE-ENCLOSING PARTS WITH AN OUTWARDLY DIRECTED CIRCUMFERENTIAL COMPARATIVELY HARD METAL FLANGE ON EACH, ONE OF SAID FLANGES HAVING A CIRCUMFERENTIAL PROTRUSION EXTENDING FROM ITS INNER FACE, THE OTHER FLANGE BEING FORMED WITH AN INNER NONGROOVED PORTION OPPOSITE SAID PROTRUSION, AT LEAST ONE OF SAID FLANGES BENG FORMED WITH AN INNER METALLURGICALLY PREBONDED COMPARATIVELY SOFT METAL FACING IN A POSITION TO BE SQUEEZED BY THE PROTRUSION WHEN THE FLANGES ARE PUSHED TOGETHER, AND CIRCUMFERENTIALLY APPLYING OPPOSING FORCES ON THE HARD METAL FLANGES TO FORCE THEM TOGETHER TO SQUEEZE SAID SOFT METAL FACING BE TWEEN THE PROTRUSION ON THE ONE FLANGE AND THE NONGROOVED PORTION ON THE OTHER FLANGE TO SOLID-PHASE BOND THE SOFT METAL TO EFFECT A STRONG HERMETICALLY SEALED CONNECTION BETWEEN THE FLANGES AT LEAST IN THE REGION OF THE PROTRUSION.

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1968-08-30 1969-03-01 1969-08-31 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1972-08-30 1973-03-01 1973-08-31 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1976-08-30 1977-03-01 1977-08-31 $7700.00 Window Closed / Lapsed

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