Wafer mounted component capable of electrical adjustment

Claim 1

A WAFER MADE OF INSULATING MATERIAL AND HAVING AT LEAST ONE ELECTRONIC COMPONENT MOUNTED THEREON OF THE TYPE HAVING AT LEAST A PORTION THEREOF CAPABLE OF BEING REMOVED FOR ADJUSTING THE CHARACTERISTICS THEREOF, SAID WAFER COMPRISING A POLYGONALLY SHAPED RELATIVELY THIN BODY HAVING PLANAR SURFACES BOUNDED BY A PERIODICALLY INTERRUPTED MARGIN, A PLURALITY OF DEPRESSIONS EXTENDING PARTIALLY THROUGH THE WAFER ON AT LEAST ONE OF SAID PLANAR SURFACES AND OCCUPYING ONLY A SMALL PORTION OF THE TOTAL SURFACE AREA THEREOF, SAID ELECTRONIC COMPONENT BEING FIXEDLY MOUNTED ON SAID WAFER WITH AT LEAST THE REMOVABLE PORTION THEREOF DISPOSED IN OVERLYING, SPACED RELATIONSHIP TO THE BOTTOM SURFACE OF AT LEAST ONE OF SAID DEPRESSIONS WHEREBY MECHANICAL MEANS MAY BE ALIGNED WITH AT LEAST SAID ONE DEPRESSION FOR SEPARATING THE REMOVABLE PORTION FROM SAID ELECTRONIC COMPONENT FOR CHANGING THE ELECTRICAL CHARACTERISTICS THEREOF, AND CONDUCTIVE MEANS EXTENDING FROM SAID COMPONENT TO THE PERIODICALLY INTERRUPTED MARGIN OF SAID WAFER.