US3199004A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Connections in semiconductor devices
Assignee: Motorola Solutions Inc
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Filing: 1961-03-10
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Granted: 1965-08-03
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Expires: 1981-03-10
Abstract
No abstract record available.
Inventors
- 👤 Jr Donald C Dickson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 10:17
CPC Classifications
H; H10; H10W; H10W72/00; H10P; H10P14/00; H10P14/40; H10P14/46; H10P72/00; H10P72/04; H10P72/0438; H10P95/00; H10W72/20; H10W76/00; H10W76/10; H10W76/12; H10W76/13; H10W76/136; H10W76/40; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
225 words
IN A SEMICONDUCTOR DEVICE WHICH HAS A SEMICONDUCTOR DIE OF SILICON MATERIAL WITH A DIFFUSED PN JUNCTION THEREIN AND HAVING PARALLEL FACES ON OPPOSITE SIDES OF SAID JUNCTION WITH THIN FILMS OF METAL PLATED ON SAID FACES, AN IMPROVED SYSTEM OF CONNECTIONS PROVIDING MECHANICAL, THERMAL AND ELECTRICAL CONNECTIONS TO SAID DIE AND INCLUDING IN COMBINATION, A MOUNTING STRUCTURE FORMING PART OF AN ENCLOSURE FOR SAID DIE AND HAVING WALLS ON THE INTERIOR OF SAID ENCLOSURE WHOSE ENTIRE SURFACE IS OF BARE COPPER MATERIAL, SAID MOUNTING STRUCTURE HAVING A BASE PORTION ON WHICH SAID DIE IS MOUNTED WITH ONE SIDE OF SAID DIE FACING SAID BASE PORTION, A LEAD STRUCTURE OF COPPER MATERIAL HAVING A PORTION ON THE INTERIOR OF SAID ENCLOSURE WHOSE ENTIRE SURFACE IS OF BARE COPPER MATERIAL, AND INDIUM-BEARING SOLDER CONNECTIONS CONNECTING SAID ONE SIDE OF SAID DIE DIRECTLY TO SAID BARE COPPER SURFACE OF SAID MOUNTING BASE AND CONNECTING THE OTHER SIDE OF SAID DIE TO SAID BARE COPPER SURFACE OF SAID LEAD STRUCTURE, SAID SOLDER CONNECTIONS CONSISTING OF ABOUT 5% BY WEIGHT OF INDIUM, ABOUT 2.5% BY WEIGHT OF SILVER, AND THE BALANCE OF LEAD, AND SAID SOLDER CONNECTIONS FORMING BONDS TO SAID SILICON DIE AND TO SAID MOUNTING BASE AND LEAD STRUCTURE HAVING COMPARATIVELY GREAT RESISTANCE TO THERMAL FATIGUE AS A RESULT OF THE SAID COMPOSITION OF SAID SOLDER CONNECTIONS.
Claim 2
Dependent Claim
225 words
IN A SEMICONDUCTOR DEVICE WHICH HAS A SEMICONDUCTOR DIE OF SILICON MATERIAL WITH A DIFFUSED PN JUNCTION THEREIN AND HAVING PARALLEL FACES ON OPPOSITE SIDES OF SAID JUNCTION WITH THIN FILMS OF METAL PLATED ON SAID FACES, AN IMPROVED SYSTEM OF CONNECTIONS PROVIDING MECHANICAL, THERMAL AND ELECTRICAL CONNECTIONS TO SAID DIE AND INCLUDING IN COMBINATION, A MOUNTING STRUCTURE FORMING PART OF AN ENCLOSURE FOR SAID DIE AND HAVING WALLS ON THE INTERIOR OF SAID ENCLOSURE WHOSE ENTIRE SURFACE IS OF BARE COPPER MATERIAL, SAID MOUNTING STRUCTURE HAVING A BASE PORTION ON WHICH SAID DIE IS MOUNTED WITH ONE SIDE OF SAID DIE FACING SAID BASE PORTION, A LEAD STRUCTURE OF COPPER MATERIAL HAVING A PORTION ON THE INTERIOR OF SAID ENCLOSURE WHOSE ENTIRE SURFACE IS OF BARE COPPER MATERIAL, AND INDIUM-BEARING SOLDER CONNECTIONS CONNECTING SAID ONE SIDE OF SAID DIE DIRECTLY TO SAID BARE COPPER SURFACE OF SAID MOUNTING BASE AND CONNECTING THE OTHER SIDE OF SAID DIE TO SAID BARE COPPER SURFACE OF SAID LEAD STRUCTURE, SAID SOLDER CONNECTIONS CONSISTING OF ABOUT 5% BY WEIGHT OF INDIUM, ABOUT 2.5% BY WEIGHT OF SILVER, AND THE BALANCE OF LEAD, AND SAID SOLDER CONNECTIONS FORMING BONDS TO SAID SILICON DIE AND TO SAID MOUNTING BASE AND LEAD STRUCTURE HAVING COMPARATIVELY GREAT RESISTANCE TO THERMAL FATIGUE AS A RESULT OF THE SAID COMPOSITION OF SAID SOLDER CONNECTIONS.
References Cited (Backward Citations)
US3037155A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1968-08-02 | 1969-02-01 | 1969-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1972-08-02 | 1973-02-01 | 1973-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1976-08-02 | 1977-02-01 | 1977-08-03 | $7700.00 | Window Closed / Lapsed |