Process for securing a conductor to a semiconductor

Claim 1

A PROCESS FOR SECURING A PLATINUM-GROUP METAL CONDUCTOR TO A SEMICONDUCTOR COMPRISING COATING AT LEAST A PORTION OF A SURFACE OF SAID SEMICONDUCTOR WITH THE REACTION PRODUCT OF CHLOROPLATINIC ACID AND DI-ISO-PROPYL ETHER CONCENTRATED IN THE PRESENCE OF NITRIC ACID, THEREAFTER SLOWLY HEATING THE COATED SURFACE OF THE SEMICONDUCTOR TO ABOUT 450*C. IN A NON-OXIDIZING ATMOSPHERE TO DECOMPOSE SAID REACTION PRODUCT AND TO PROVIDE A PLATINUM LAYER FIRMLY ADHERENT TO SAID SEMICONDUCTOR SURFACE, COOLING SAID LAYER TO ABOUT ROOM TEMPERATURE, CONNECTING THE END OF A PLATINUM-GROUP METAL CONDUCTOR HAVING A FLATTENED END TO SAID PLATINUM LAYER BY COATING SAID LAYER WITH A PASTE-LIKE DISPERSION OF PLATINUM-GROUP METAL POWDER IN A LIQUID, THERMALLY DECOMPOSABLE COMPOUND SELECTED FROM THE GROUP CONSISTING OF (A) ALKALINE CONDENSED METHANOL NETHYL CYCLOHEZANE POLYMER IN 2ETHOXY ETHANOL, (B) THE REACTION PRODUCT OF CHLOROPLATINIC ACID AND DI-ISO-PROPYL ETHER CONCENTRATED IN THE PRESENCE OF NITRIC ACID AND (C) A SOLUTION OF GOLD-TERTIARY-DODECYLMERCAPTAN IN HEPTANE CONTAINING 30% GOLD, EMBEDDING SAID FLATTENED END IN SAID COATING TO COMPLETELY COVER SAID FLATTENED CONDUCTOR END, AND THEREAFTER SLOWLY HEATING THE THUS FORMED ASSEMBLY TO A TEMPERATURE IN THE RANGE FROM ABOUT 400*C. TO ABOUT 450*C. IN A NON-OXIDIZING ATMOSPHERE TO DECOMPOSE SAID REACTION PRODUCT AND TO FORM AN ADHERENT METAL MASS WHICH SECURES SAID CONDUCTOR TO SAID PLATINUM LAYERS.