Cutting and forming transistor leads

Claim 1

APPARATUS FOR CUTTING AND FORMING A PLURALITY OF LEADS EXTENDING FROM AN ELECTRONIC COMPONENT COMPRISING: NESTING MEANS INCLUDING A PLURALITY OF SLOTS, EACH OF SAID SLOTS BEING ARRANGED TO RECEIVE A DIFFERENT ONE OF SAID LEADS, RECIPROCAL DRIVING MEANS, CLAMPING MEANS RESILIENTLY MOUNTED AND DRIVEN BY SAID DRIVING MEANS FOR CLAMPING SAID LEADS IN SAID SLOTS AT A POINT NEAR SAID COMPONENTS SO THAT SAID LEADS ARE HELD FIRMLY THROUGHOUT THE CUTTING AND FORMING OPERATION, SHEARING MEANS DRIVEN BY SAID DRIVING MEANS AND ADAPTED FOR SHEARING SAID LEADS AFTER THEY HAVE BEEN CLAMPED BY SAID CLAMPING MEANS TO CUT EACH OF SAID LEADS TO A GIVEN LENGTH, AND FORMING MEANS DRIVEN BY SAID DRIVING MEANS AND ADAPTED FOR BENDING SAID LEADS INTO PREDETERMINED SHAPES AFTER THEY HAVE BEEN CUT BY SAID SHEARING MEANS.