Means for encapsulating transistors

Claim 1

IN A CASING FOR A TRANSISTOR FABRICATED OF A GERMANIUM WAFER AND AN INDIUM RECTIFYING CONTACT ALLOYED ON EACH FACE THEREOF TO FORM COLLECTOR AND EMITTER ELECTRODES, A HOLLOW FLANGED HOUSING WITHIN WHICH THE TRANSISTOR IS SEALED, A SUBSTANTIALLY FLAT METALLIC MEMBER HAVING GOOD HEAT AND ELECTRICAL CONDUCTING PROPERTIES AND AN ANNULAR GROOVE THEREIN IN WHICH SAID FLANGED PORTION OF SAID HOUSING SEATS, SAID MEMBER HAVING A RAISED PLATEAU AREA ON ONE FACE TO THE TOP OF WHICH ONE OF THE INDIUM SURFACES OF THE TRANSISTOR IS SOLDERED TO SECURE THE TRANSISTOR TO THE FLAT METALLIC MEMBER, A PORTION OF THE FLAT METALLIC MEMBER INTERJACENT SAID GROOVE AND THE PERIPHERY OF SAID FACE BEING FOLDED OVER THE FLANGE OF THE HOUSING THROUGHOUT ITS CIRCUMFERENCE AND PRESSED DOWN THEREON TO HERMETICALLY SEAL THE PARTS TOGETHER, AND A COATING OF A SEALING MATERIAL INTERJACENT SAID FLANGE AND A SURFACE OF SAID GROOVE TO ASSIST IN SEALING THE PARTS OF THE CASING TOGETHER.