US3107422A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Rhodium diffusion process for bonding and sealing of metallic parts
Assignee: Bendix Corp
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Filing: 1961-05-16
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Granted: 1963-10-22
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Expires: 1981-05-16
Abstract
No abstract record available.
Inventors
- 👤 Jr Alfred E Eckermann
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 14:52
CPC Classifications
B; B23; B23K; B23K35/00; B23K35/22; B23K35/24; B23K35/32; B23K35/322; B23K20/00; B23K20/22; B23K20/233; B23K35/001; Y; Y10; Y10S; Y10S428/00; Y10S428/922; Y10S428/9335; Y10S428/934; Y10S428/939; Y10T; Y10T428/00; Y10T428/12; Y10T428/12493; Y10T428/12771; Y10T428/12861; Y10T428/12868; Y10T428/12903; Y10T428/1291
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
96 words
A PROCESS OF BONDING COPPER SURFACES BY MEANS OF AN ELECTROPLATED RHODIUM SEAL COMPRISING THE STEPS OF PLATING THE COPPER SURFACES TO BE UNITED WITH A FILM OF RHODIUM; HOLDING THE RHODIUM PLATED SURFACES FIRMLY TOGETHER AND HEATING THE SURFACES SUFFICIENTLY TO CAUSE THE RHODIUM FILM ON ONE SURFACE TO DIFFUSE INTO THE RHODIUM FILM ON THE OTHER SURFACE AND INTO THE ADJACENT COPPER SURFACES; AND THEREAFTER COOLING THE SURFACES SO AS TO UNITE THE RESPECTIVE PARTS AND CAUSE THE DIFFUSED RHODIUM FILMS TO FORM WITH THE COPPER SURFACES A MECHANICALLY STRONG AND HERMETICALLY THIGHT SEAL.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-10-21 | 1967-04-22 | 1967-10-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-10-21 | 1971-04-22 | 1971-10-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-10-21 | 1975-04-22 | 1975-10-22 | $7700.00 | Window Closed / Lapsed |