US3101244A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for molding articles
Assignee: Davidson Rubber Co Inc
•
Filing: 1960-10-21
•
Granted: 1963-08-20
•
Expires: 1980-10-21
Abstract
No abstract record available.
Inventors
- 👤 Hood Bruce Gardner
- 👤 Ralph S Hood
- 👤 Robert A Gardella
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 19:27
CPC Classifications
B; B29; B29C; B29C33/00; B29C33/56; B29C33/60; B29C33/62; B29C44/00; B29C44/34; B29C44/36; B29C44/38; B29C44/40; C; C10; C10M; C10M7/00; B29K; B29K2075/00; C10M2205/00; C10M2205/14; C10M2205/16; C10M2205/17; C10N; C10N2050/00; C10N2050/015; C10N2050/02; C10N2050/08; C10N2050/10; Y; Y10; Y10S; Y10S425/00; Y10S425/012
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
199 words
A METHOD FOR MOLDING ARTICLES FROM THERMO-SETTING RESINS WHICH RESINS DURING CURING ARE INITIALLY EXTREMELY ACTIVE AND ADHERENT TO MOLD SURFACES, BUT BECOME PROGRESSIVELY LESS ACTIVE AND NON-ADHERENT AS THE CURE PROGRESSES; SAID METHOD INCLUDING THE STEPS OF: DETERMINING THE PREFERRED TEMPERATURE RANGE FOR THE CURE OF SAID RESIN; SELECTING A THERMOPLASTIC FILM FORMING MATERIAL WITH A FUSION POINT SUBSTANTIALLY WITHIN SAID RANGE; APPLYING A CONTINUOUS FILM OF SAID THERMOPLASTIC MATERIAL TO THE SURFACE OF A MOLD; INTRODUCING SAID RESIN IN THE UNCURED STATE INTO SAID MOLD WITH THE TEMPERATURE OF SAID MOLD BEING AT A FIRST TEMPERATURE WITHIN SAID RANGE BUT BELOW THE MELTING POINT OF SAID THERMOPLASTIC MATERIAL; MAINTAINING SAID MOLD AT A TEMPERATURE BELOW SAID FUSION POINT UNTIL SAID RESIN HAS PARTIALLY CURED AND DE-ACTIVATED SUFFICIENTLY NOT TO ADHERE TO SAID MOLD; THEREAFTER ELEVATING THE TEMPERATURE OF SAID MOLD TO A SECOND TEMPERATURE WITHIN SAID RANGE BUT AT LEAST AS HIGH AS THE FUSION POINT OF SAID THERMOPLASTIC MATERIAL; WHEREBY THE CURE IS ACCELERATED AND SAID TERMOPLASTIC MATERIAL IS MELTED; MAINTAINING SAID MOLD AT SAID SECOND TEMPERATURE UNTIL SAID CURE IS SUBSTANTIALLY COMPLETE; AND WITHDRAWING SAID CURED RESIN FROM SAID MOLD WHILE MAINTAINING SAID SECOND TEMPERATURE.
Claim 2
Independent Claim
199 words
A METHOD FOR MOLDING ARTICLES FROM THERMO-SETTING RESINS WHICH RESINS DURING CURING ARE INITIALLY EXTREMELY ACTIVE AND ADHERENT TO MOLD SURFACES, BUT BECOME PROGRESSIVELY LESS ACTIVE AND NON-ADHERENT AS THE CURE PROGRESSES; SAID METHOD INCLUDING THE STEPS OF: DETERMINING THE PREFERRED TEMPERATURE RANGE FOR THE CURE OF SAID RESIN; SELECTING A THERMOPLASTIC FILM FORMING MATERIAL WITH A FUSION POINT SUBSTANTIALLY WITHIN SAID RANGE; APPLYING A CONTINUOUS FILM OF SAID THERMOPLASTIC MATERIAL TO THE SURFACE OF A MOLD; INTRODUCING SAID RESIN IN THE UNCURED STATE INTO SAID MOLD WITH THE TEMPERATURE OF SAID MOLD BEING AT A FIRST TEMPERATURE WITHIN SAID RANGE BUT BELOW THE MELTING POINT OF SAID THERMOPLASTIC MATERIAL; MAINTAINING SAID MOLD AT A TEMPERATURE BELOW SAID FUSION POINT UNTIL SAID RESIN HAS PARTIALLY CURED AND DE-ACTIVATED SUFFICIENTLY NOT TO ADHERE TO SAID MOLD; THEREAFTER ELEVATING THE TEMPERATURE OF SAID MOLD TO A SECOND TEMPERATURE WITHIN SAID RANGE BUT AT LEAST AS HIGH AS THE FUSION POINT OF SAID THERMOPLASTIC MATERIAL; WHEREBY THE CURE IS ACCELERATED AND SAID TERMOPLASTIC MATERIAL IS MELTED; MAINTAINING SAID MOLD AT SAID SECOND TEMPERATURE UNTIL SAID CURE IS SUBSTANTIALLY COMPLETE; AND WITHDRAWING SAID CURED RESIN FROM SAID MOLD WHILE MAINTAINING SAID SECOND TEMPERATURE.
References Cited (Backward Citations)
US1809445A
Cited
US2227809A
Cited
US2764565A
Cited
US2804653A
Cited
US2879196A
Cited
US2851330A
Cited
US3006033A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-08-19 | 1967-02-18 | 1967-08-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-08-19 | 1971-02-18 | 1971-08-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-08-19 | 1975-02-18 | 1975-08-20 | $7700.00 | Window Closed / Lapsed |