US3097425A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of soldering copper connection
Assignee: —
•
Filing: —
•
Granted: 1963-07-16
•
Expires: 1980-07-16
Abstract
No abstract record available.
Inventors
No inventors recorded.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 07:54
CPC Classifications
H; H10; H10N; H10N10/00; H10N10/80; H10N10/82; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
52 words
A METHOD OF SOLDERING COPPER CONDUCTOR STRIPS TO COOLING THERMOPILE ELECTRODES COMPRISING APPLYING 0.2 TO 0.3 MM. THICK COATING OF AN ALLOY OF 99% BISMUTH AND 1% TIN TO A THERMOPILE ELECTRODE, THEN SOLDERING A COPPER CONDUCTOR ONTO THE COATING EMPLOYING AN ALLOY HAVING A MELTING POINT WHICH DOES NOT EXCEED 140*C.
Claim 2
Independent Claim
52 words
A METHOD OF SOLDERING COPPER CONDUCTOR STRIPS TO COOLING THERMOPILE ELECTRODES COMPRISING APPLYING 0.2 TO 0.3 MM. THICK COATING OF AN ALLOY OF 99% BISMUTH AND 1% TIN TO A THERMOPILE ELECTRODE, THEN SOLDERING A COPPER CONDUCTOR ONTO THE COATING EMPLOYING AN ALLOY HAVING A MELTING POINT WHICH DOES NOT EXCEED 140*C.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-07-15 | 1967-01-14 | 1967-07-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-07-15 | 1971-01-14 | 1971-07-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-07-15 | 1975-01-14 | 1975-07-16 | $7700.00 | Window Closed / Lapsed |