US3086281A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor leads and method of attaching
Assignee: Individual
•
Filing: 1957-05-06
•
Granted: 1963-04-23
•
Expires: 1977-05-06
Abstract
No abstract record available.
Inventors
- 👤 Shockley William
- 👤 Arnold O Beckman
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 12:48
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/481; H10W70/479; H10W72/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49787; Y10T29/4981; Y10T428/00; Y10T428/12; Y10T428/12347; Y10T428/12361; Y10T428/12368; Y10T428/12486; Y10T428/12493; Y10T428/12528; Y10T428/12701
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
81 words
THE METHOD OF ATTACHING LEADS TO A PLURALITY OF SEMICONDUCTOR DEVICES IN ONE OPERATION WHICH COMPRISES FORMING A LEAD ASSEMBLY BY PUNCHING TONGUES IN A SHEET OF LEAD MATERIAL, WHICH TONGUES EXTEND OUTWARDLY WITH THEIR END PORTIONS IN A COMMON PLANE, BRINGING SAID END PORTIONS IN CONTACT WITH THE SURFACE OF A WAFER OF SEMICONDUCTOR MATERIAL HAVING THE DESIRED COMPOSITIONAL STRUCTURE, BONDING SAID END PORTIONS TO THE WATER AND SUBSE QUENTLY DICING THE WAFER TO FORM DEVICES HAVING LEADS ATTACHECD THERETO.
Claim 2
Independent Claim
81 words
THE METHOD OF ATTACHING LEADS TO A PLURALITY OF SEMICONDUCTOR DEVICES IN ONE OPERATION WHICH COMPRISES FORMING A LEAD ASSEMBLY BY PUNCHING TONGUES IN A SHEET OF LEAD MATERIAL, WHICH TONGUES EXTEND OUTWARDLY WITH THEIR END PORTIONS IN A COMMON PLANE, BRINGING SAID END PORTIONS IN CONTACT WITH THE SURFACE OF A WAFER OF SEMICONDUCTOR MATERIAL HAVING THE DESIRED COMPOSITIONAL STRUCTURE, BONDING SAID END PORTIONS TO THE WATER AND SUBSE QUENTLY DICING THE WAFER TO FORM DEVICES HAVING LEADS ATTACHECD THERETO.
Claim 3
Dependent Claim
74 words
AS A TRANSITORY ARTICLE OF MANUFACTURE, A FIRST AND A SECOND UNIT, SAID FIRST UNIT COMPRISING A WAFER OF SEMICONDUCTOR MATERIAL HAVING THE DESIRED COMPOSITIONAL STRUCTURE, SAID SECOND UNIT COMPRISING A LEAD ASSEMBLY INCLUDING A SHEET OF LEAD MTERIAL HAVING A PLURALITY OF OUTWARDLY EXTENDING TONGUES AT PREDETERMINED POINTS, SAID LEAD ASSEMBLY BEING IN CONTACT WITH SAID WAFER AT PREDETERMINED POINTS DEFINED BY THE ENDS OF THE TONGUES, SAID CONTACTS BEING LOW RESISTANCE BONDS.
Claim 4
Dependent Claim
74 words
AS A TRANSITORY ARTICLE OF MANUFACTURE, A FIRST AND A SECOND UNIT, SAID FIRST UNIT COMPRISING A WAFER OF SEMICONDUCTOR MATERIAL HAVING THE DESIRED COMPOSITIONAL STRUCTURE, SAID SECOND UNIT COMPRISING A LEAD ASSEMBLY INCLUDING A SHEET OF LEAD MTERIAL HAVING A PLURALITY OF OUTWARDLY EXTENDING TONGUES AT PREDETERMINED POINTS, SAID LEAD ASSEMBLY BEING IN CONTACT WITH SAID WAFER AT PREDETERMINED POINTS DEFINED BY THE ENDS OF THE TONGUES, SAID CONTACTS BEING LOW RESISTANCE BONDS.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-04-22 | 1966-10-22 | 1967-04-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-04-22 | 1970-10-22 | 1971-04-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-04-22 | 1974-10-22 | 1975-04-23 | $7700.00 | Window Closed / Lapsed |