US3081586A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Dicing semiconductor crystals
Assignee: Clevite Corp
•
Filing: 1960-03-29
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Granted: 1963-03-19
•
Expires: 1980-03-29
Abstract
No abstract record available.
Inventors
- 👤 Gersbach Wilhelm
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 14:02
CPC Classifications
B; B28; B28D; B28D5/00; B28D5/0058; B28D5/02; B28D5/022; B28D5/029
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
72 words
A METHOD OF CUTTING A PLATE OF SEMICONDUCTOR MATERIAL INTO WAFERS COMPRISING: FREEZING A LAYER OF ICE ONTO A WORK HOLDER; DISPOSING AT LEAST ONE PLATE OF A SEMICONDUCTOR MATERIAL ON SAID LAYER OF ICE; FORMING AN ADDITION AL LAYER OF ICE, SUSPERIMPOSED ON SAID FIRST MENTIONED LAYER AND AT LEAST PARTIALLY ENBEDDING THE PLATE DISPOSED THEREON; AND CUTTING THROUGH SAID PLATE AND ADDITIONAL LAYER OF ICE INTO SAID FIRST-MENTIONED ICE LAYER.
Claim 2
Independent Claim
72 words
A METHOD OF CUTTING A PLATE OF SEMICONDUCTOR MATERIAL INTO WAFERS COMPRISING: FREEZING A LAYER OF ICE ONTO A WORK HOLDER; DISPOSING AT LEAST ONE PLATE OF A SEMICONDUCTOR MATERIAL ON SAID LAYER OF ICE; FORMING AN ADDITION AL LAYER OF ICE, SUSPERIMPOSED ON SAID FIRST MENTIONED LAYER AND AT LEAST PARTIALLY ENBEDDING THE PLATE DISPOSED THEREON; AND CUTTING THROUGH SAID PLATE AND ADDITIONAL LAYER OF ICE INTO SAID FIRST-MENTIONED ICE LAYER.
References Cited (Backward Citations)
US995537A
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US1969238A
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US2167215A
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US2511962A
Cited
US2586532A
Cited
US2641879A
Cited
US2937437A
Cited
US2905064A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1966-03-18 | 1966-09-17 | 1967-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1970-03-18 | 1970-09-17 | 1971-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1974-03-18 | 1974-09-17 | 1975-03-19 | $7700.00 | Window Closed / Lapsed |