Tipped component lead for printed circuit boards

Claim 1

FOR USE IN SOLDER-DIP CONNECTING ELECTRICAL COMPONENTS TO PRINTED CIRCUIT BOARDS, A PRINTED CIRCUIT BOARD HAVING AN UNPLATED APERTURE, A METALLIC PAD SURROUNDING THE APERTURE ON ONE SURFACE OF SAID BOARD, A TIPPED COMPONENT LEAD INSERTED AND WEDGED IN THE APERTURE IN CONTACT WITH THE PAD, WHICH TIPPED LEAD COMPRISES A METALLIC FERRULE COLD-FORGED ABOUT AND GRIPPING THE END OF THE COMPONENT LEAD TO FORM THEREWITH A COMPOSITE TIP TAPERING TOWARD THE INSERTION END THEREOF, THE FERRULE INCLUDING A BOTTOM WEB CONNECTING WITH SIDEWALL PORTIONS AT SHARP ANGLED CORNERS TO DEFINE LONGITUDINAL EDGES FOR BITING INTO THE METALLIC PAD FOR CONDUCTING HEAT FROM A SOLDER BATH TO THE PAD, SAID SIDEWALL PORTIONS BEING INWARDLY BENT TOWARD ONE ANOTHER BUT SPACED TO DEFINE A GROOVE THEREBETWEEN LINEARLY EXTENDING ALONG THE TIP, A PLURALITY OF GROOVES IN SAID WEB ADJACENT SAID CORNERS, SAID GROOVES LINEARLY EXTENDING ALONG AT LEAST THE PORTION OF SAID TIP DISPOSED WITHIN THE THICKNESS OF SAID BOARD AND DEFINING CAPILLARY PASSAGES FOR INDUCING THE FLOW OF SOLDER ALONG THE TIP AND ONTO THE PAD.