US3065534A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of joining a semiconductor to a conductor
Assignee: TDK Micronas GmbH
•
Filing: 1955-03-30
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Granted: 1962-11-27
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Expires: 1975-03-30
Abstract
No abstract record available.
Inventors
- 👤 Jr Anthony J Marino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 13:37
CPC Classifications
H; H10; H10P; H10P14/00; H10P14/40; H10P14/46; H10P95/00; Y; Y10; Y10S; Y10S228/00; Y10S228/903; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
105 words
A METHOD OF JOINING A SEMICONDUCTOR TO A CONDUCTOR TO ESTABLISH A RIGID LOW-RESISTANCE CONTACT THEREBETWEEN COMPRISING THE STEPS OF DISPOSING A BONDING METAL BETWEEN A SEMICONDUCTOR BODY AND A CONDUCTOR THEREBY FORMING AN ASSEMBLY, SURROUNDING SAID ASSEMBLY WITH NONOXIDIZING ATMOSPHERE, HEATING SAID ASSEMBLY IN SAID ATMOSPHERE TO A SELECTED TEMPERATURE, SAID TEMPERATURE BEING BELOW THE MELTING POINT OF THE BONDING METAL AND ABOVE THE MELTING POINT OF THE EUTECTIC ALLOY FORMED, AND, MAINTAINING THE ASSEMBLY AT SAID SELECTED TEMPERATURE WHEREBY AN ALLOY IS FORMED WITH SAID SELECTED TEMPERATURE AT LEAST SAID SEMICONDUCTOR BODY, SAID SEMICONDUCTOR BODY BEING RHODIUM-PLATED SILICON, SAID BONDING METAL BEING GOLD.
Claim 2
Independent Claim
105 words
A METHOD OF JOINING A SEMICONDUCTOR TO A CONDUCTOR TO ESTABLISH A RIGID LOW-RESISTANCE CONTACT THEREBETWEEN COMPRISING THE STEPS OF DISPOSING A BONDING METAL BETWEEN A SEMICONDUCTOR BODY AND A CONDUCTOR THEREBY FORMING AN ASSEMBLY, SURROUNDING SAID ASSEMBLY WITH NONOXIDIZING ATMOSPHERE, HEATING SAID ASSEMBLY IN SAID ATMOSPHERE TO A SELECTED TEMPERATURE, SAID TEMPERATURE BEING BELOW THE MELTING POINT OF THE BONDING METAL AND ABOVE THE MELTING POINT OF THE EUTECTIC ALLOY FORMED, AND, MAINTAINING THE ASSEMBLY AT SAID SELECTED TEMPERATURE WHEREBY AN ALLOY IS FORMED WITH SAID SELECTED TEMPERATURE AT LEAST SAID SEMICONDUCTOR BODY, SAID SEMICONDUCTOR BODY BEING RHODIUM-PLATED SILICON, SAID BONDING METAL BEING GOLD.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1965-11-26 | 1966-05-28 | 1966-11-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1969-11-26 | 1970-05-28 | 1970-11-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1973-11-26 | 1974-05-28 | 1974-11-27 | $7700.00 | Window Closed / Lapsed |