Photopolymerization process of image reproduction

Claim 1

A PROCESS WHICH COMPRISES (A) PLACING A LAYER OF FINELY DIVIDED DISCRETE PARTICLES OF MATERIAL WHICH ARE SOLID AT THE TRANSFER TEMPERATURE AND ARE LOOSELY BOUND IN SAID LAYER, INTO CONTACT WITH THE SURFACE OF A SEPARATE LAYER CONTAINING A THERMOSPLASTIC IMAGE IN SAID SURFACE, SAID SEPERATE LAYER BEING SOLID BELOW 40*C. AND CONTAINING (1) UNDEREXPOSED IMAGE AREAS WHICH ARE THERMALLY TRANSFERABLE ON CONTACT BY HAVING A TRANSFER TEMPERATURE ABOVE 40*C. AND BELOW 220%C. COMPRISING (A) A THERMOPLASTIC ORGANIC POLYMER SOLID AT 50*C. AND (B) AN ETHYLENICALLY UNSATURATED COMPOUND CONTAINING AT LEAST ONE TERMINAL ETHYLENIC GROUP, HAVING A BOILING POINT ABOVE 100*C. AT NORMAL ATMOSPHERIC PRESSURE, BEING CAPABLE OF FORMING A HIGH POLYMER BY PHOTOINITATED ADDITION POLYMERIZATION AND HAVING A PLASTICIZING ACTION ON SAID THERMOPLASTIC POLYMER; SAID CONSTITUENTS (A) AND (B) BEING PRESENT IN AMOUNTS FROM 3 TO 97 AND 97 TO 3 PARTS BY WEIGHT, RESPECTIVELY, AND (2) EXPOSED COMPLEMENTARY ADJOINING COPLANAR NON-TACKY IMAGE AREAS SOLID AT 50* C. AND COMPRISING AN ADDITIONAL POLYMER OF AN AFORESAID UNSATURATED COMPOUND AND SAID THERMOPLASTIC POLYMER, (B) MAINTAINING SAID SURFACE IN CONTACT WHILE MAINTAINING THE SURFACE OF SAID SEPARATE LAYER AT A TEMPERATURE OF AT LEAST 40*C. AND ABOVE THE TACK TEMPERATURE OF THE UNDEREXPOSED IMAGE AREAS AND (C) SEPERATING SAID SURFACES TO TRANSFER PARTICLES IN THE UNDEREXPOSED IMAGE AREAS TO THE SURFACE OF THE SEPERATE LAYER.