US3060013A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of growing copper filaments
Assignee: Motors Liquidation Co
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Filing: 1960-03-07
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Granted: 1962-10-23
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Expires: 1980-03-07
Abstract
No abstract record available.
Inventors
- 👤 Douglas J Harvey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 09:48
CPC Classifications
B; B21; B21C; B21C37/00; B21C37/06; B21C37/15; Y; Y10; Y10S; Y10S75/00; Y10S75/952; Y10T; Y10T428/00; Y10T428/12; Y10T428/12431; Y10T428/12438; Y10T428/12493; Y10T428/12701; Y10T428/12771; Y10T428/12861; Y10T428/12903
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
116 words
A METHOD FOR PRODUCING COPPER FILAMENTS COMPRISING THE STEPS OF PLACING A LAYER OF COPPER HAVING A SURFACE IN CONTACT WITH A LEAD ALLOY LAYER HAVING OPPOSED FIRST AND SECOND SURFACES WHEREBY SAID COPPER SURFACE IS IN CONTACT WITH SAID FIRST LEAD ALLOY SURFACE, SAID LEAD ALLOY LAYER BEING SELECTED FROM THE GROUP CONSISTING OF LEAD-SULFUR ALLOYS, LEAD-TELLURIUM ALLOYS AND LEAD-SELENIUM ALLOYS, HEATING SAID COPPER AND LEAD ALLOY LAYER IN AN INERT ENVIRONMENT TO A TEMPERATURE BELOW THE MELTING POINT OF COPPER AND SUFFICIENT TO MELT THE SAID FIRST LEAD ALLOY SURFACE AND TO ESTABLISH A TEMPERATURE DIFFERENTIAL BETWEEN THE SAID COPPER LAYER SURFACE AND SIAD SECOND LEAD ALLOY SURFACE WHICH IS EXPOSED TO SAID ENVIRONMENT.
Claim 2
Independent Claim
116 words
A METHOD FOR PRODUCING COPPER FILAMENTS COMPRISING THE STEPS OF PLACING A LAYER OF COPPER HAVING A SURFACE IN CONTACT WITH A LEAD ALLOY LAYER HAVING OPPOSED FIRST AND SECOND SURFACES WHEREBY SAID COPPER SURFACE IS IN CONTACT WITH SAID FIRST LEAD ALLOY SURFACE, SAID LEAD ALLOY LAYER BEING SELECTED FROM THE GROUP CONSISTING OF LEAD-SULFUR ALLOYS, LEAD-TELLURIUM ALLOYS AND LEAD-SELENIUM ALLOYS, HEATING SAID COPPER AND LEAD ALLOY LAYER IN AN INERT ENVIRONMENT TO A TEMPERATURE BELOW THE MELTING POINT OF COPPER AND SUFFICIENT TO MELT THE SAID FIRST LEAD ALLOY SURFACE AND TO ESTABLISH A TEMPERATURE DIFFERENTIAL BETWEEN THE SAID COPPER LAYER SURFACE AND SIAD SECOND LEAD ALLOY SURFACE WHICH IS EXPOSED TO SAID ENVIRONMENT.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1965-10-22 | 1966-04-23 | 1966-10-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1969-10-22 | 1970-04-23 | 1970-10-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1973-10-22 | 1974-04-23 | 1974-10-23 | $7700.00 | Window Closed / Lapsed |