US3053725A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Coating of sheet material
Assignee: National Steel Corp
•
Filing: 1958-05-13
•
Granted: 1962-09-11
•
Expires: 1978-05-13
Abstract
No abstract record available.
Inventors
- 👤 Arthur E Uhleen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:48
CPC Classifications
B; B05; B05D; B05D3/00; B05D3/02; B05D3/0218; B05D3/12; B05D7/00; B05D7/50; B05D7/52; B05D7/54; B05D7/542; Y; Y10; Y10T; Y10T156/00; Y10T156/17; Y10T156/1702; Y10T156/1712; Y10T156/1722; Y10T156/1727
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
236 words
A METHOD OF APPLYING ORGANIC FILM MATERIAL TO HEAT RESISTANT SHEET MATERIAL HAVING A HEAT-ACTIVATABLE ADHESIVE COMPOSITION FOR ORGANIC FILM MATERIAL THEREON COMPRISING ACTIVATING THE ADHESIVE BY HEATING THE SHEET MATERIAL TO AN ELEVATED TEMPERATURE NOT LESS THAN THE FLOW TEMPERATURE OF THE ADHESIVE, APPLYING ORGANIC FILM MATERIAL ON A SURFACE OF THE SHEET MATERIAL HAVING ACTIVATED ADHESIVE THEREON WHILE THE SHEET MATERIAL IS AT AN ELEVATED TEMPERATURE NOT LESS THAN THE FLOW TEMPERATURE OF THE ADHESIVE AND UNDER PRESSURE TO ADHERE THE ORGANIC FILM MATERIAL TO THE SHEET MATERIAL, AND COOLING THE RESULTANT SHEET MATERIAL BELOW THE FLOW TEMPERATURE OF THE ADHESIVE THE ADHESIVE HAVING A FLOW TEMPERATURE ABOVE NORMAL ROOM TEMPERATURE AND THE APPLIED ORGANIC FILM MATERIAL TENDING TO SHRINK FROM THE EDGES OF THE HEAT RESISTANT SHEET MATERIAL WHEN THE RESULTANT SHEET MATERIAL IS COOLED AT NORMAL ROOM TEMPERATURE, THE RESULTANT SHEET MATERIAL BEING COOLED AND SHRINKAGE OF THE ORGANIC FILM MATERIAL FROM THE EDGES OF THE HEAT RESISTANT SHEET MATERIAL BEING REDUCED BY CONTACTING IT WITH A COOLING FLUID HAVING A TEMPERATURE BELOW NORMAL ROOM TEMPERATURE WHEREBY AT LEAST THE SURFACE OF THE SHEET MATERIAL HAVING ORGANIC FILM THEREON AND THE ADHESIVE ARE COOLED TO A TEMPERATURE BELOW THE FLOW TEMPERATURE OF THE ADHESIVE OVER AT LEAST A MAJOR PORTION OF THE PERIOD THE INTERIOR OF THE SHEET MATERIAL IS BEING COOLED TO A TEMPERATURE BELOW THE FLOW TEMPERATURE OF THE ADHESIVE.
Claim 2
Independent Claim
236 words
A METHOD OF APPLYING ORGANIC FILM MATERIAL TO HEAT RESISTANT SHEET MATERIAL HAVING A HEAT-ACTIVATABLE ADHESIVE COMPOSITION FOR ORGANIC FILM MATERIAL THEREON COMPRISING ACTIVATING THE ADHESIVE BY HEATING THE SHEET MATERIAL TO AN ELEVATED TEMPERATURE NOT LESS THAN THE FLOW TEMPERATURE OF THE ADHESIVE, APPLYING ORGANIC FILM MATERIAL ON A SURFACE OF THE SHEET MATERIAL HAVING ACTIVATED ADHESIVE THEREON WHILE THE SHEET MATERIAL IS AT AN ELEVATED TEMPERATURE NOT LESS THAN THE FLOW TEMPERATURE OF THE ADHESIVE AND UNDER PRESSURE TO ADHERE THE ORGANIC FILM MATERIAL TO THE SHEET MATERIAL, AND COOLING THE RESULTANT SHEET MATERIAL BELOW THE FLOW TEMPERATURE OF THE ADHESIVE THE ADHESIVE HAVING A FLOW TEMPERATURE ABOVE NORMAL ROOM TEMPERATURE AND THE APPLIED ORGANIC FILM MATERIAL TENDING TO SHRINK FROM THE EDGES OF THE HEAT RESISTANT SHEET MATERIAL WHEN THE RESULTANT SHEET MATERIAL IS COOLED AT NORMAL ROOM TEMPERATURE, THE RESULTANT SHEET MATERIAL BEING COOLED AND SHRINKAGE OF THE ORGANIC FILM MATERIAL FROM THE EDGES OF THE HEAT RESISTANT SHEET MATERIAL BEING REDUCED BY CONTACTING IT WITH A COOLING FLUID HAVING A TEMPERATURE BELOW NORMAL ROOM TEMPERATURE WHEREBY AT LEAST THE SURFACE OF THE SHEET MATERIAL HAVING ORGANIC FILM THEREON AND THE ADHESIVE ARE COOLED TO A TEMPERATURE BELOW THE FLOW TEMPERATURE OF THE ADHESIVE OVER AT LEAST A MAJOR PORTION OF THE PERIOD THE INTERIOR OF THE SHEET MATERIAL IS BEING COOLED TO A TEMPERATURE BELOW THE FLOW TEMPERATURE OF THE ADHESIVE.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1965-09-10 | 1966-03-12 | 1966-09-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1969-09-10 | 1970-03-12 | 1970-09-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1973-09-10 | 1974-03-12 | 1974-09-11 | $7700.00 | Window Closed / Lapsed |