Process for electroforming grooved and channeled bodies

Claim 1

A PROCESS FOR PRODUCING A METALLIC BODY HAVING A PASSAGE BELOW ITS SURFACE, COMPRISING THE STEPS OF APPLYING A NON-CONDUCTIVE MASKING AGENT AS A COVERING LAYER TO A SURFACE OF A CONDUCTIVE SUPPORT, TOPPING SAID COVERING LAYER WITH A CONDUCTIVE LAYER, EXPOSING A SELECTED AREA OF SAID SUPPORT BY REMOVING A PORTION OF BOTH OF SAID LAYERS WHILE MAINTAINING SAID CONDUCTIVE LAYER INSULATED FROM SAID SUPPORT, CATHODICALLY CONNECTING SAID SUPPORT IN AN ELECTROPLATING CIRCUIT, ELECTROLYTICALLY DEPOSITING A METALLIC COATING ON THE EXPOSED AREA OF THE SUPPORT THUS CONNECTED CONTINUING THE BUILDUP OF SAID COATING BEYOND A POINT AT WHICH IT COMPLETES THE CIRCUIT OF SAID CONDUCTIVE LAYER WHEREBY A PORTION OF SAID COATING WILL EXTEND OVER BOTH OF SAID LAYERS, AND REMOVING SAID MASKING AGENT.