US3010057A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Westinghouse Electric Corp
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Filing: 1960-09-06
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Granted: 1961-11-21
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Expires: 1980-09-06
Abstract
No abstract record available.
Inventors
- 👤 Williard S Albert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 03:47
CPC Classifications
H; H10; H10W; H10W99/00; H10W72/00; H10W72/20
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
215 words
IN A SEMICONDUCTOR DEVICE, IN COMBINATION, A BRITTLE WAFER OF SEMICONDUCTOR MATERIAL SELECTED FROM THE GROUP CONSISTING OF SILICON AND GERMANIUM, THE WAFER BEING OF SUBSTANTIAL AREA AND RELATIVELY THIN, METAL SUPPORT PLATES JOINED TO OPPOSITE SIDES OF THE WAFER OF SEMICONDUCTOR MATERIAL WITH A LAYER OF SOLDER WHICH PROVIDES JOINTS OF GOOD THERMAL AND ELECTRICAL CONDUCTIVITY, THE COEFFICIENT OF EXPANSION OF SAID SUPPORT PLATES BEING SUBSTANTIALLY THE SAME AS THE COEFFICIENT OF EXPANSION OF SAID WAFER OF SEMICONDUCTOR MATERIAL THROUGHOUT THE TEMPERATURE RANGE TO WHICH THE SEMICONDUCTOR DEVICE IS SUBJECTED IN MANUFACTURE AND USE, A FIRST TERMINAL MEMBER HAVING A SUBSTANTIALLY DIFFERENT COEFFICIENT OF EXPANSION THAN SAID SEMICONDUCTOR WAFER, A FIRST METAL MEMBER HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AS SAID SUPPORT PLATES ATTACHED TO SAID FIRST TERMINAL MEMBER WITH A LAYER OF HARD MATERIAL, A LAYER OF SOFT SOLDER ATTACHING SAID FIRST METAL MEMBER TO ONE OF SAID SUPPORT PLATES, A SECOND TERMINAL MEMBER HAVING A SUBSTANTIALLY THE SAME COEFFICIENT OF OF EXPANSION THAN SAID SEMICONDUCTOR WAFER, A SECOND METAL MEMBER HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AS SAID SUPPORT PLATES ATTACHED TO SAID SECOND TERMINAL MEMBER WITH A LAYER OF HARD MATERIAL, AND A LAYER OF SOFT SOLDER ATTACHING SAID SECOND METAL MEMBER TO THE OTHER OF SAID SUPPORT PLATE.
Claim 2
Dependent Claim
215 words
IN A SEMICONDUCTOR DEVICE, IN COMBINATION, A BRITTLE WAFER OF SEMICONDUCTOR MATERIAL SELECTED FROM THE GROUP CONSISTING OF SILICON AND GERMANIUM, THE WAFER BEING OF SUBSTANTIAL AREA AND RELATIVELY THIN, METAL SUPPORT PLATES JOINED TO OPPOSITE SIDES OF THE WAFER OF SEMICONDUCTOR MATERIAL WITH A LAYER OF SOLDER WHICH PROVIDES JOINTS OF GOOD THERMAL AND ELECTRICAL CONDUCTIVITY, THE COEFFICIENT OF EXPANSION OF SAID SUPPORT PLATES BEING SUBSTANTIALLY THE SAME AS THE COEFFICIENT OF EXPANSION OF SAID WAFER OF SEMICONDUCTOR MATERIAL THROUGHOUT THE TEMPERATURE RANGE TO WHICH THE SEMICONDUCTOR DEVICE IS SUBJECTED IN MANUFACTURE AND USE, A FIRST TERMINAL MEMBER HAVING A SUBSTANTIALLY DIFFERENT COEFFICIENT OF EXPANSION THAN SAID SEMICONDUCTOR WAFER, A FIRST METAL MEMBER HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AS SAID SUPPORT PLATES ATTACHED TO SAID FIRST TERMINAL MEMBER WITH A LAYER OF HARD MATERIAL, A LAYER OF SOFT SOLDER ATTACHING SAID FIRST METAL MEMBER TO ONE OF SAID SUPPORT PLATES, A SECOND TERMINAL MEMBER HAVING A SUBSTANTIALLY THE SAME COEFFICIENT OF OF EXPANSION THAN SAID SEMICONDUCTOR WAFER, A SECOND METAL MEMBER HAVING SUBSTANTIALLY THE SAME COEFFICIENT OF EXPANSION AS SAID SUPPORT PLATES ATTACHED TO SAID SECOND TERMINAL MEMBER WITH A LAYER OF HARD MATERIAL, AND A LAYER OF SOFT SOLDER ATTACHING SAID SECOND METAL MEMBER TO THE OTHER OF SAID SUPPORT PLATE.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1964-11-20 | 1965-05-22 | 1965-11-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1968-11-20 | 1969-05-22 | 1969-11-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1972-11-20 | 1973-05-22 | 1973-11-21 | $7700.00 | Window Closed / Lapsed |