Resinous composition comprising a polyamide and an organosiloxane resin and conductor coated therewith

Claim 1

A RESINOUS COMPOSITION COMPRISING, IN COMBINATION, (A) 100 PARTS BY WEIGHT OF A POLYAMIDE RESIN COMPOSITION DERIVED BY ADMIXING AND HEATING (1) FROM ABOUT 1 MOLE TO 2 MOLES OF AN UNSATURATED ACIDIC COMPOUND SELECTED FROM THE GROUP CONSISTING OF MALEIC ACID, MALEIC ANHYDRIDE, FUMARIC ACID, DIBUTLYMALEATE AND THE MONOMETHYL SUBSTITUTION DERIVATIVES FOR THE NONCARBOXYL HYDROGEN THEREOF AND (2) ONE MOLE OF A POLYAMIDE REACTION PRODUCT HAVING TERMINAL AMINO GROUPS AND HAVING AN AVERAGE MOLECULAR WEIGHT OF NOT IN EXCESS OF 1500, SAID POLYAMIDE HAVING TERMINAL AMINO GROUPS BEING DERIVED BY REACTING ONE MOLE OF A PRIMARY HYDROCARBON DIAMINE HAVING FROM 2 TO 6 CARBON ATOMS, AND FROM 0.1 MOLE TO 0.9 MOLE OF A DICARBOXYLIC ACID SELECTED FROM THE GROUP CONSISTING OF ISOPHTHALIC ACID, TEREPHTHALIC ACID, AND ALIPHATIC DICARBOXYLIC ACIDS AND ANHYDRIDES THEREOF HAVING NO ETHYLENIC UNSATURATION AND HAVING AT LEAST TWO AND NO MORE THAN EIGHT NONCARBOXYL CARBON ATOMS, THE ACIDS HAVING NO OTHER REACTIVE GROUPS THAN THE CARBOXYL GROUPS AND THE ANHYDRIDES HAVING NO OTHER REACTIVE GROUPS THAN THE ANHYDRIDE GROUPS AND (B) FROM 1 PART TO 50 PARTS BY WEIGHT OF A SOLVENT SOLUBLE, HEAT-HARDENABLE ORGANOSILOXANE RESIN HAVING FROM 1.3 TO 1.95 HYDROCARBON GROUPS PER SILICON ATOM.