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US2879244A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of making destaticized synthetic resin

Assignee: Individual
•
Filing: 1954-12-17
•
Granted: 1959-03-24
•
Expires: 1974-12-17
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Abstract

No abstract record available.

Inventors

  • 👤 Myron A Coler

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 17:08
CPC Classifications
C; C08; C08F; C08F2/00; C08F2/44; Y; Y10; Y10S; Y10S260/00; Y10S260/15

Claims Analysis

Total Claims: 2
Claim 1
Independent Claim 126 words
THE METHOD OF PRODUCING A DESTATICIZED SYNTHETIC RESIN WHICH COMPRISES POLYMERIZING AN ETHYLENIC MONOMER IN THE PRESENCE OF AN ADDITIVE COMPRISING A LIQUID ORGANIC COMPOUND HAVING A DIELECTRIC CONSTANT GREATER THAN 25 AND A BOILING POINT GREATER THAN 190* C., SORBED ONTO CARRIER PARTICLES HAVING A PARTICLE SIZE SMALLER THAN 44 MICRONS AND A SORPTION FACTOR GREATER THAN 0.5 AND INSOLUBLE IN SAID ORGANIC COMPOUND AND SAID MONOMER; THE RATIO OF SAID ORGANIC COMPOUND TO SAID CARRIER PARTICLES BEING IN THE RANGE OF 0.2 TO 1.2 TIMES SAID SORPTION FACTOR; SAID MONOMER, SAID ORGANIC COMPOUND AND SAID CARRIER PARTICLES BEING MUTUALLY NON-REACTIVE AND STABLE DURING POLYMERIZATION AND SAID ORGANIC COMPOUND AND SAID CARRIER PARTICLES BEING MUTUALLY NON-REACTIVE AND STABLE UNDER NORMAL MOLDING CONDITIONS FOR SAID RESIN.
Claim 2
Independent Claim 126 words
THE METHOD OF PRODUCING A DESTATICIZED SYNTHETIC RESIN WHICH COMPRISES POLYMERIZING AN ETHYLENIC MONOMER IN THE PRESENCE OF AN ADDITIVE COMPRISING A LIQUID ORGANIC COMPOUND HAVING A DIELECTRIC CONSTANT GREATER THAN 25 AND A BOILING POINT GREATER THAN 190* C., SORBED ONTO CARRIER PARTICLES HAVING A PARTICLE SIZE SMALLER THAN 44 MICRONS AND A SORPTION FACTOR GREATER THAN 0.5 AND INSOLUBLE IN SAID ORGANIC COMPOUND AND SAID MONOMER; THE RATIO OF SAID ORGANIC COMPOUND TO SAID CARRIER PARTICLES BEING IN THE RANGE OF 0.2 TO 1.2 TIMES SAID SORPTION FACTOR; SAID MONOMER, SAID ORGANIC COMPOUND AND SAID CARRIER PARTICLES BEING MUTUALLY NON-REACTIVE AND STABLE DURING POLYMERIZATION AND SAID ORGANIC COMPOUND AND SAID CARRIER PARTICLES BEING MUTUALLY NON-REACTIVE AND STABLE UNDER NORMAL MOLDING CONDITIONS FOR SAID RESIN.

References Cited (Backward Citations)

US2467341A Cited
US2579375A Cited
US2624725A Cited
US2692863A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1962-03-23 1962-09-22 1963-03-24 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1966-03-23 1966-09-22 1967-03-24 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1970-03-23 1970-09-22 1971-03-24 $7700.00 Window Closed / Lapsed

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