US2663684A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of and composition for plating copper
Assignee: Houdaille Hershey Corp
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Filing: 1952-06-02
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Granted: 1953-12-22
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Expires: 1972-06-02
Abstract
No abstract record available.
Inventors
- 👤 William J Pierce
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 10:23
CPC Classifications
C; C25; C25D; C25D3/00; C25D3/02; C25D3/38
Claims Analysis
Total Claims: 1
Claim 1
Independent Claim
40 words
AN ELECTROLYTE FOR ELECTRODEPOSITING COPPER CONSISTING ESSENTIALLY OF AN AQUEOUS ACID SOLUTION OF COPPER SULFATE AND FREE SULFURIC ACID AND HAVING DISSOLVED THEREIN, AS A BRIGHTENER FOR THE ELECTRO-DEPOSITED COPPER, A HETEROCYCLIC COMPOUND HAVING THE FOLLOWING HETEROCYCLIC RING STRUCTURAL ARRANGEMENT
References Cited (Backward Citations)
CA461186A
Cited
US2609339A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1956-12-21 | 1957-06-22 | 1957-12-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1960-12-21 | 1961-06-22 | 1961-12-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1964-12-21 | 1965-06-22 | 1965-12-22 | $7700.00 | Window Closed / Lapsed |