Process of chemical nickel plating

Claim 1

THE CONTINUOUS PROCESS OF CHEMICALLY PLATING WITH NICKEL A SOLID BODY ESSENTIALLY COMPRISING AN ELEMENT SELECTED FROM THE GROUP CONSISTING OF IRON, COBALT, NICKEL, ALUMINUM, COPPER, SILVER, GOLD, PALLADIUM AND PLATINU, WHICH COMPRISES PROVIDING AN AQUEOUS SOLUTION OF A NICKEL SALT AND A HYPOPHOSPHITE, WHEREIN THE RATIO BETWEEN THE NICKEL IONS AND THE HYPOPHOSPHITE IONS IN SAID SOLUTION IS WITHIN A FIRST PREDETERMINED RANGE AND THE ABSOLUTE CONCENTRATION OF THE HYPOPHOSPHITE IONS IN SAID SOLUTION IS WITHIN A SECOND PREDETERMINED RANGE AND THE PH OF SAID SOLUTION IS WITHIN A THIRD PREDETERMINED RANGE, STORING THE BULK OF SAID SOLUTION AT A RELATIVELY LOW TEMPERATURE WELL BELOW THE BOILING POINT THEREOF IN A RESERVOIR, HOLDING A SMALL PORTION OF SAID SOLUTION AS A BATH AT A RELATIVELY HIGH TEMPERATURE SLIGHTLY BELOW THE BOILING POINT THEREOF IN A PLATING CHAMBER, CIRCULATING SAID SOLUTION AT A LOW RATE FROM SAID RESERVOIR TO SAID PLATING CHAMBER AND THEN BACK TO SAID RESERVOIR, HEATING SAID SOLUTION SUBSTANTIALLY TO SAID RELATIVELY HIGH TEMPERATURE AFTER WITHDRAWAL THEREOF FROM INTO RESERVOIR AND BEFORE INTRODUCTION THEREOF INTO SAID PLATING CHAMBER, COOLING SAID SOLUTION SUBSTANTIALLY TO SAID RELATIVELY LOW TEMPERATURE AFTER WITHDRAWAL THEREOF FROM SAID PLATING CHAMBER AND BEFORE RETURN THEREOF TO SAID RESERVOIR, IMMERSING SAID BODY IN SAID BATH IN SAID PLATING CHAMBER, WITHDRAWING SAID BODY FROM SAID BATH IN SAID PLATING CHAMBER AFTER A TIME INTERVAL CORRESPONDING TO THE THICKNESS OF THE NICKEL PLATING THEREON THAT IS DESIRED, AND ADDING DURING SAID TIME INTERVAL SOLUBLE REAGENTS TO SAID SOLUTION IN SAID RESERVOIR TO MAINTAIN IN SAID BATH IN SAID PLATING CHAMBER DURING SAID TIME INTERVAL SAID RATIO AND SAID ABSOLUTE CONCENTRATION AND SAID PH RESPECTIVELY IN SAID FIRST AND SAID SECOND AND SAID THIRD PREDETERMINED RANGES.