US2624916A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Glossy molding process for ethylene polymers
Assignee: EIDP Inc
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Filing: 1951-02-19
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Granted: 1953-01-13
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Expires: 1971-02-19
Abstract
No abstract record available.
Inventors
- 👤 Persak Kenneth John
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 19:15
CPC Classifications
B; B29; B29C; B29C45/00; B29C45/17; B29C45/26; B29C45/37; B29C33/00; B29C33/56; B29C45/0001; B29K; B29K2023/00; B29K2023/04; B29K2023/06; B29K2861/00; B29K2861/04; B29K2861/20; B29K2995/00; B29K2995/0018; B29K2995/0022; Y; Y10; Y10S; Y10S425/00; Y10S425/055
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
168 words
IN A PROCESS FOR THE MOLDING OF SOLID POLYMERS OF ETHYLENE TO GLOSSY SURFACED ARTICLES, THE STEPS WHICH COMPRISE CHARGING A NORMALLY SOLID POLYMER OF ETHYLENE FROM A MOLTEN STATE AND AT A TEMPERATURE BETWEEN 275* F. AND 450* F. INTO A METAL MOLD OF THE DESIRED SHAPE, IN WHICH THE METAL OF THE MOLD IS SEPARATED FROM THE ETHYLENE POLYMER BY A LAYER OF INSULATION FIRMLY BOUND TO THE METAL OF THE MOLD OF A HEAT-CONVERTED THERMOSET RESIN OF THE GROUP CONSISTING OF UREAFORMALDEHYDE RESINS, PHENOL-FORMALDEHYDE RESINS, RESORCINOL-FORMALDEHYDE RESINS, MELAMINEFORMALDEHYDE RESINS, POLYBASIC ACID/POLYHYDRIC ALCOHOL RESINS AND COMBINATIONS THEREOF, MOLDING THE POLYMER OF ETHYLENE AT A TEMPERATURE BETWEEN THE MELTING POINT OF THE POLYMER AND BELOW ITS DECOMPOSITION POINT, SOLIDIFYING THE POLYMER IN THE MOLD AT A TEMPERATURE BELOW THE MELTING POINT OF THE POLYMER WHILE IN CONTACT WITH THE INSULATING LAYER, THE INSULATING LAYER BEING FROM 0.5 TO 5 MILS IN THICKNESS AND HAVING A SURFACE IN CONTACT WITH POLYMER OF ETHYLENE THAT CARRIES A HIGH POLISH.
Claim 2
Dependent Claim
168 words
IN A PROCESS FOR THE MOLDING OF SOLID POLYMERS OF ETHYLENE TO GLOSSY SURFACED ARTICLES, THE STEPS WHICH COMPRISE CHARGING A NORMALLY SOLID POLYMER OF ETHYLENE FROM A MOLTEN STATE AND AT A TEMPERATURE BETWEEN 275* F. AND 450* F. INTO A METAL MOLD OF THE DESIRED SHAPE, IN WHICH THE METAL OF THE MOLD IS SEPARATED FROM THE ETHYLENE POLYMER BY A LAYER OF INSULATION FIRMLY BOUND TO THE METAL OF THE MOLD OF A HEAT-CONVERTED THERMOSET RESIN OF THE GROUP CONSISTING OF UREAFORMALDEHYDE RESINS, PHENOL-FORMALDEHYDE RESINS, RESORCINOL-FORMALDEHYDE RESINS, MELAMINEFORMALDEHYDE RESINS, POLYBASIC ACID/POLYHYDRIC ALCOHOL RESINS AND COMBINATIONS THEREOF, MOLDING THE POLYMER OF ETHYLENE AT A TEMPERATURE BETWEEN THE MELTING POINT OF THE POLYMER AND BELOW ITS DECOMPOSITION POINT, SOLIDIFYING THE POLYMER IN THE MOLD AT A TEMPERATURE BELOW THE MELTING POINT OF THE POLYMER WHILE IN CONTACT WITH THE INSULATING LAYER, THE INSULATING LAYER BEING FROM 0.5 TO 5 MILS IN THICKNESS AND HAVING A SURFACE IN CONTACT WITH POLYMER OF ETHYLENE THAT CARRIES A HIGH POLISH.
References Cited (Backward Citations)
US2232475A
Cited
US2485238A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1956-01-13 | 1956-07-14 | 1957-01-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1960-01-13 | 1960-07-14 | 1961-01-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1964-01-13 | 1964-07-14 | 1965-01-13 | $7700.00 | Window Closed / Lapsed |