Copolymers of vinyl aryl compounds, acrylonitrile, diallyl esters, and unsaturated dicarboxylic acids and their anhydrides and products produced therefrom

Claim 1

INSULATION COMPRISING MICA FLAKES AND A RESINOUS BINDER APPLIED TO THE MICA FLAKES, THE RESINOUS BINDER COMPRISING THE THERMOSET REACTION PRODUCT DERIVED BY REFLUXING IN AN ORGANIC SOLVENT HAVING A BOILING POINT OF FROM 50* C. TO 130* C. FROM 1 TO 4 MOLES OF ACRYLONITRILE, FROM 2 TO 4 MOLES OF MONOSTYRENE, FROM 3/4 TO 2 MOLES OF MALEIC ANHYDRIDE, FROM 1/2 TO 3 MOLES OF DIALLYL PHTHALATE, AND FROM 0.5 TO 5%, BASED ON THE WEIGHT OF THE REACTANTS, OF A PEROXIDE CATALYST, THE REFLUXING BEING CONDUCTED AT A TEMPERATURE OF BETWEEN 50* C. AND 130* C. FOR A PERIOD OF TIME, THE TIME BEING OF THE ORDER OF 5 HOURS FOR A REFLUX TEMPERATURE OF FROM 70* C. TO 110* C. WITH FROM 1 TO 4% OF THE PEROXIDE CATALYST, THE TIME FOR OTHER TEMPERATURES AND OTHER CATALYST PROPORTIONS BEING INVERSELY PROPORTIONAL TO THE REFLUX TEMPERATURE AND THE AMOUNT OF CATALYST PRESENT, THE REFLUXING BEING CARRIED OUT OT A POINT SHORT OF PRODUCING AN INSOLUBLE RESIN, THE RESIN SOLUTION SO DERIVED BEING APPLIED TO THE MICA FLAKES, THE SOLVENT EVAPORATED THE MICA FLAKES AND APPLIED RESIN HEATED ABOVE A TEMPERATURE OF 130* C. TO PRODUCE THE THERMOSET RESIN.