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US10558779B2 Active / In Force US ⏱️ 11.6 years remaining

Method of redistribution layer routing for 2.5-dimensional integrated circuit packages

Assignee: AnaGlobe Tech Inc
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Filing: 2018-05-31
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Granted: 2020-02-11
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Expires: 2038-05-31
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Abstract

Abstract A method of redistribution layer routing for 2.5D integrated circuit packages is proposed, which is executed by a computer, the method comprising using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets to tracks such that total vertical distance from each bump pair to the assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps connected to the assigned tracks according to matching result to complete redistribution layer routing for integrated circuit packages.

Inventors

  • 👤 Chun-Han CHIANG
  • 👤 Fu-Yu CHUANG
  • 👤 Yao-Wen Chang
  • 👤 Chih-Che Lin
  • 👤 Chun-Yi Yang

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 04:07
CPC Classifications
G06F17/5077; G; G06; G06F; G06F30/00; G06F30/30; G06F30/39; G06F30/394; G06F17/5081; G06F30/398

Claims Analysis

Total Claims: 22
Claim 1
Independent Claim 175 words
A non-transitory computer-readable medium containing instructions, which when read and executed by a computer, cause the computer to execute a method of redistribution layer routing for 2.5-dimensional integrated circuits package having a first layer with multiple chips, a second layer with an interposer and a third layer with a substrate, wherein said first layer is configured on said second layer and said second layer is configured on said third layer, wherein the method comprises steps of: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets on said first layer to tracks on said second layer and said third layer such that total vertical distance from each bump pair of said pre-assignment nets to said assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps such that said bumps are connected to said assigned tracks and said pre-assignment nets are routed on redistribution layers (RDLs) according to matching result of said MWMCBM to complete redistribution layer routing for said 2.5-dimensional integrated circuits package.
Claim 2
Dependent Claim 175 words
A non-transitory computer-readable medium containing instructions, which when read and executed by a computer, cause the computer to execute a method of redistribution layer routing for 2.5-dimensional integrated circuits package having a first layer with multiple chips, a second layer with an interposer and a third layer with a substrate, wherein said first layer is configured on said second layer and said second layer is configured on said third layer, wherein the method comprises steps of: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets on said first layer to tracks on said second layer and said third layer such that total vertical distance from each bump pair of said pre-assignment nets to said assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps such that said bumps are connected to said assigned tracks and said pre-assignment nets are routed on redistribution layers (RDLs) according to matching result of said MWMCBM to complete redistribution layer routing for said 2.5-dimensional integrated circuits package.
Claim 3
Dependent Claim 15 words
The non-transitory computer-readable medium of claim 1 , further comprising acquiring a process technology file.
Claim 4
Dependent Claim 23 words
The non-transitory computer-readable medium of claim 2 , wherein said process technology file comprises redistribution layer (RDL) layout, pre-assignment netlists, and design rules.
Claim 5
Dependent Claim 77 words
The non-transitory computer-readable medium of claim 3 , wherein said design rules comprises: each said pre-assignment nets shielded by a power/ground net; spacings of said tracks on adjacent layers larger than minimum spacing between a track and a power/ground net on an identical layer; spacings of said pre-assignment nets on said identical layer larger than said minimum spacing between a track and a power/ground net on said identical layer; and said tracks routed in an interposer region.
Claim 6
Dependent Claim 22 words
The non-transitory computer-readable medium of claim 1 , wherein said MMSIM based routing includes a process of performing a shielding structure alignment.
Claim 7
Dependent Claim 27 words
The non-transitory computer-readable medium of claim 5 , wherein said MMSIM based routing further includes a process of computing target position for track block and shielding block.
Claim 8
Dependent Claim 30 words
The non-transitory computer-readable medium of claim 6 , wherein said MMSIM based routing further includes a process of performing a net order decision of said pre-assignment nets and layer assignment.
Claim 9
Dependent Claim 38 words
The non-transitory computer-readable medium of claim 6 , wherein said target position for shielding block aligns to a bottom of track block in odd number layer and aligns to a top of track block in even number layer.
Claim 10
Dependent Claim 20 words
The non-transitory computer-readable medium of claim 1 , wherein said MWMCBM based routing includes a process of distance-aware edge construction.
Claim 11
Dependent Claim 23 words
The non-transitory computer-readable medium of claim 9 , wherein said MWMCBM based routing further includes a process of a bipartite matching track assignment.
Claim 12
Independent Claim 166 words
A method of redistribution layer routing for 2.5-dimensional integrated circuits package having a first layer with multiple chips, a second layer with an interposer and a third layer with a substrate, wherein said first layer is configured on said second layer and said second layer is configured on said third layer, which is executed by a computer, the method comprising: using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets on said first layer to tracks on said second layer and said third layer such that total vertical distance from each bump pair of said pre-assignment nets to said assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps such that said bumps are connected to said assigned tracks and said pre-assignment nets are routed on redistribution layers (RDLs) according to matching result of said MWMCBM to complete redistribution layer routing for said 2.5-dimensional integrated circuits package.
Claim 13
Independent Claim 166 words
A method of redistribution layer routing for 2.5-dimensional integrated circuits package having a first layer with multiple chips, a second layer with an interposer and a third layer with a substrate, wherein said first layer is configured on said second layer and said second layer is configured on said third layer, which is executed by a computer, the method comprising: using the computer to perform the following: performing a MMSIM (modulus-based matrix splitting iteration method) based routing to assign pre-assignment nets on said first layer to tracks on said second layer and said third layer such that total vertical distance from each bump pair of said pre-assignment nets to said assigned track is minimized; and performing a MWMCBM (minimum weighted maximum cardinality bipartite matching) based routing for bumps such that said bumps are connected to said assigned tracks and said pre-assignment nets are routed on redistribution layers (RDLs) according to matching result of said MWMCBM to complete redistribution layer routing for said 2.5-dimensional integrated circuits package.
Claim 14
Dependent Claim 13 words
The method of claim 11 , further comprising acquiring a process technology file.
Claim 15
Dependent Claim 21 words
The method of claim 12 , wherein said process technology file comprises redistribution layer (RDL) layout, pre-assignment netlists, and design rules.
Claim 16
Dependent Claim 75 words
The method of claim 13 , wherein said design rules comprises: each said pre-assignment nets shielded by a power/ground net; spacings of said tracks on adjacent layers larger than minimum spacing between a track and a power/ground net on an identical layer; spacings of said pre-assignment nets on said identical layer larger than said minimum spacing between a track and a power/ground net on said identical layer; and said tracks routed in an interposer region.
Claim 17
Dependent Claim 20 words
The method of claim 11 , wherein said MMSIM based routing includes a process of performing a shielding structure alignment.
Claim 18
Dependent Claim 25 words
The method of claim 15 , wherein said MMSIM based routing further includes a process of computing target position for track block and shielding block.
Claim 19
Dependent Claim 28 words
The method of claim 16 , wherein said MMSIM based routing further includes a process of performing a net order decision of said pre-assignment nets and layer assignment.
Claim 20
Dependent Claim 36 words
The method of claim 16 , wherein said target position for shielding block aligns to a bottom of track block in even number layer and aligns to a top of track block in odd number layer.
Claim 21
Dependent Claim 18 words
The method of claim 11 , wherein said MWMCBM based routing includes a process of distance-aware edge construction.
Claim 22
Dependent Claim 21 words
The method of claim 19 , wherein said MWMCBM based routing further includes a process of a bipartite matching track assignment.

References Cited (Backward Citations)

US20090032925A1 Cited
US20090309235A1 Cited
US20150179570A1 Cited
US20180032660A1 Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2023-02-10 2023-08-12 2024-02-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2027-02-10 2027-08-12 2028-02-11 $3760.00 Pending Window
11.5 Years (Year 12) 2031-02-10 2031-08-12 2032-02-11 $7700.00 Pending Window

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