Epoxy resin

Abstract

Abstract PURPOSE:To obtain an epoxy resin which is excellent in heat resistance, weather resistance and water resistance, by submitting 4-vinylbicyclo[2,2,1]hept-1-ene oxide to a ring opening polymn. in the presence of an org. active hydrogen as an initiator and then epoxidizing the product. CONSTITUTION:4-Vinylbicyclo[2,2,1]hept-1-ene oxide is submitted to a ring opening polymn. in the presence of an org. active hydrogen compd. (e.g., trimethylolpropane) as an initiator to give an unsatd. compd. of formula I (where R1 is an org. compd. residue having l active hydrogen atoms; n1-nl are each 0.1-100, and their sum is 1-100; l is 1-100; A is of formula 11). This unsatd. compd. is then reacted with an epoxidizing agent (e.g., peracetic acid) to give an epoxy resin formula IV (where B is of the formula V; X is of the formula III, -CH=CH2, etc.) contg. at least one group of formula III. This resin is favorably used as a resin for sealing semiconductors.

Inventors

• 👤 Takaaki Murai
• 👤 Katsuhisa Sakai

Bibliographic Details