Board for mounting semiconductor element

Abstract

Abstract PURPOSE:To obtain a semiconductor element mounting board with high heat dissipation at low costs by forming a metallic layer on the surface of a semiconductor element mounting part in a semiconductor element board having a metallic layer on the back side of the resin formed board, arranging a throughhole on the semiconductor element mounting part, and filling a solder in the throughhole. CONSTITUTION:A semiconductor element mounting board 10 is so constructed that a semiconductor element mounting part 12 and a conductive circuit 11 are formed atop the board consisting of an organic resin material 14. In such semiconductor element mounting board 10, a metallic layer 13a as well as a throughhole 15 are formed on the semiconductor element mounting part 12, the metallic layer 13a being in conduction with a metallic layer 13b on the back side of the board, or on the opposite surface of the semiconductor element mounting part 12, while the throughhole 15 being filled with a solder 16.

Inventors

• 👤 Naoto Ishida

Bibliographic Details