Semiconductor device

Abstract

Abstract PURPOSE:To obtain a semiconductor device with excellent radiating capability and effective light screenability or light transmissivity depending on semiconductor chip applications by making a package part consist of a white aluminum nitride baked body and a black aluminum nitride baked body. CONSTITUTION:A semiconductor chip 1 is mounted on a conductive layer 2 formed on a base part 3 which consists of a white aluminum nitride baked body, the thermal conductivity thereof being 170W/m.K, a frame part 4 which consists of a black, light-screening aluminum nitride baked body is bonded on the peripheral of the top of the base part 3, a lid part 5 which consists of the same aluminum nitride baked body as the frame part 4 is bonded thereupon. The base part 3 and the frame part 4, as well as the frame part 4 and the lid part 5 are bonded together, respectively by a normal method such as brazing or a active metal method after forming a metallized layer thereupon, and then hermetically sealed.

Inventors

• 👤 Yutaka Komorida
• 👤 Nobuyuki Mizunoya
• 👤 Masakazu Hatori

Bibliographic Details