Manufacture of chip capacitor

Abstract

Abstract PURPOSE:To prevent the electrical connection of a ground electrode and a top face electrode by forming a first trench, which does not reach up to the surface from the rear of a substrate, shaping a metallic layer onto the whole surface of the rear including the first trench and forming a second trench reaching the surface of the substrate narrower in width than that of the first trench in the first trench. CONSTITUTION:The surface side of a high dielectric-constant substrate 101 is bonded with a support board 104 such as an silicon substrate with wax 105, and a first trench 11, which does not reach the surface from the rear side of the substrate, is shaped by a blade dicing saw, etc., in 80mum depth and 100mum width. For form an electrode for grounding onto a side face and an underside, nichrome in 1000Angstrom and gold in 10000Angstrom are evaporated through a planetarium system, and the electrode 12 for grounding is shaped onto the side face and the underside. A second trench 21 reaching the surface of the substrate is formed into the first trench 11, in which the electrode for grounding on the side face and the underside is shaped, in 120mum depth and 70mum width. Wax 105 is melted and removed, and the substrate is separated from the support board 104, thus acquiring each chip capacitor.

Inventors

• 👤 Masami Ito

Bibliographic Details