Semiconductor device

Abstract

Abstract PURPOSE:To suppress open-circuiting between electrodes due to release between resin and substrate or between semiconductor chips by including gap control agent within insulation resin to relax stress of semiconductor chip after curing of insulation resin. CONSTITUTION:By providing a protrusion electrode 3 at either wiring of a semiconductor chip 1 or that of a substrate 6, for example at a wiring 5 of the substrate 6, a gap control agent 2 is included within an insulation resin 4 in a semiconductor device bonded by the insulation resin 4. It allows a uniform height within the semiconductor chip to be maintained and load applied to each protrusion electrode to be held at a constant level for preventing open- circuiting between electrodes.

Inventors

• 👤 Hitoshi Miyasaka

Bibliographic Details