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JPS6480944A Expired / Lapsed JP ⏱️ 0.0 years remaining

Photosensitive resin composition

Assignee: Hitachi Ltd
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Filing: 1987-09-24
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Granted: —
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Expires: 2007-09-24
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Abstract

Abstract PURPOSE:To obtain an eximer laser beam resist simultaneously satisfying all the requirements of sensitivity, resolution, resistance to reactive ion etching (RIE) by incorporating an alkali-soluble resin containing aromatic rings, and an aliphatic diazoketone as main components. CONSTITUTION:The resist contains as the main components the alkali-soluble resin containing aromatic rings, and the aliphatic diazoketone containing at least one of aliphatic diazoketones derived from cholic acid, deoxycholic acid, or lithocholic acid, and said ketones are the derivatives represented by formulae I-III in which R1 is H or 1-10C alkyl; R2 is H or a diazoketone group represented by formula IV, but all the plural OR2 are not H at the same time, thus permitting the obtained KrF eximer laser beam resist to be superior in all of sensitivity and resolution and RIE resistance.

Inventors

  • 👤 Hisashi Sugiyama
  • 👤 Kazuo Nate
  • 👤 Akiko Mizushima

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-05 01:20
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/016; G03F7/0163

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