Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To improve a moisture resistance of a semiconductor pellet, by making an island smaller than the base of the semiconductor pellet and making its island come into contact with the center part at the inside of each edge part in all sides of the pellet. CONSTITUTION:An island 11 has a rectangular form and two pins 13 for suspending the island extend in opposite directions from both edge parts of the island. The island 11 has an area which is smaller than the base area of the pellet 2. The base center of the pellet 2 is fixed to the island 11 after bonding it on to the island. The edge parts 4 of the pellet come into contact neither with the island 11 nor with the above pins 13, by which the island 11 is supported. Thus, even though moisture and the like enter into the island through the pins 13, it is required for them to move a long distance so as to reach a diffused plane 5 on the upper face of the pellet 2 and then, they find difficulty in reaching the diffused plane 5. In this way, such a structure improves a moisture resistance of the pellet 2.

Inventors

• 👤 Atsushi Takahashi

Bibliographic Details