Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To prevent defective insulation, etc., due to a solder ball by coating the surface of a substrate with a protective film composed of polyvalent alcohol after solder plating and forming a bump electrode. CONSTITUTION:A first foundation electrode 3 is connected to a semiconductor element shaped into a semiconductor substrate 1, and extended up to the periphery of a chip. An electrically isolated solder plating layer 10 is formed onto a second foundation electrode 8. The whole surface of the substrate 1 is coated with a protective film 11 composed of polyvalent alcohol with the exception of the solder plating layer 10. The protective film 11 having high viscosity coats a surface protective film 4, and protects the film 4 during the formation of a bump electrode 12. The whole semiconductor substrate 1 is heated, the solder plating layer 10 is melted, and the spherical bump electrode 12 is formed. The protective film 11 having high viscosity is removed with lower alcohol, and solder balls 13 scattered on the surface are also gotten rid of together with lower alcohol.

Inventors

• 👤 Shoji Sakamura

Bibliographic Details