Semiconductor circuit device

Abstract

Abstract PURPOSE:To decrease the wiring density of a printed wiring board, and reduce the cost of printed wiring board, by alternately arranging and connecting a usual IC package element and the other IC package element in which functional arrangement of external leads is inverted. CONSTITUTION:An IC package element 10 and a usual IC package element 10' are alternately arranged on a printed wiring board. As to external terminals 1-8 of each 10 package element, the same number terminals are connected with each other by wiring, in the manner in which the number of cross parts 9 becomes minimum on the printed wiring board. For example, in the case of wireconnecting an external terminal 8 of the usual IC package element 10 and an external terminal 8 of the IC package element 10, the wiring on the printed wiring board is enabled without crossing the other wiring. Further, in the case of mutually connecting external leads 1 of each IC package, three cross parts 9 are sufficient for the case where six cross parts are required in total by two usual blocks.

Inventors

• 👤 Hideto Nitta

Bibliographic Details