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JPS647522A Expired / Lapsed JP ⏱️ 0.0 years remaining

X-ray mask and manufacture thereof

Assignee: Oki Electric Industry Co Ltd
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Filing: 1987-06-30
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Granted: —
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Expires: 2007-06-30
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Abstract

Abstract PURPOSE:To improve the adhesion between silicon and a masking material while preventing stress, peeling off and twisting of a film from being caused by a method wherein a masking material to be formed in grooves as an X-ray mask is formed on the surface of silicon. CONSTITUTION:A masking material 4 to be buried in grooves 6a is formed on the surface of silicon. A protective film 4 in high X-ray transmissivity is formed on the surface; simultaneously the rear side is etched away leaving A part to be an X-ray mask forming the peripheral part of silicon wafer into a frame; the thickness t' of silicon wafer is set up to be almost similar to the thickness t of a holding film 8. This thickness t' is set up to meet the X-ray transmitting requirements of silicon. Finally, X-ray mask is manufactured by fixing a ring type glass frame 1 for reinforcement of the X-ray mask holding film 3. Through these procedures, the masking material 4 is buried in the grooves 6a as a holding film 3 so that the adhesion between the silicon wafer 6 and the masking material 4 may be improved while preventing stress, peeling off and twisting of the holding film.

Inventors

  • 👤 Masayoshi Ino
  • 👤 Shintaro Ushio

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-07 18:34
CPC Classifications
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Claims Analysis

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References Cited (Backward Citations)

JPS53104176A Cited
JPS58202526A Cited

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