Fixing structure for positioning semiconductor laser chip and input lens

Abstract

Abstract PURPOSE:To conduct the positioning displacement adjustment of a mounting support member to a heat sink member easily and rapidly by utilizing the relative contacting positions of the heat sink member and a projection section for the mounting support member as a reference position. CONSTITUTION:A mounting support member 38 can be displaced in the front and rear direction, the vertical direction, the left and the right direction, etc., to a heat sink member 34 by bringing a projection section 44 in the mounting support member 38 along a straight line into contact with the heat sink member 34. Even when the mounting support member 38 is used as a fine adjustment base, the mounting support member 38 is maintained under a contacting state at all times with the heat sink member 34 by the projection section 44 when the mounting support member is displaced to the heat sink member 34, thus allowing alignment displacement adjustment by employing the relative contacting positions of the heat sink member 34 and the projection section 44 as a reference position on the positioning operation of a semiconductor laser chip 30 and a spherical lens 36.

Inventors

• 👤 Hiroki Okujima
• 👤 Kenji Tagawa
• 👤 Takayuki Masuko
• 👤 Shoichi Miura

Bibliographic Details