Semiconductor device

Abstract

Abstract PURPOSE:To suppress the acceleration of corrosion and disappearance of a bonding pad by a method wherein at least one of more bonding pads are isolated independently in the area smaller than the area where a bonding wire is bonded, and an isolation film is buried in the gap of each bonding pad. CONSTITUTION:A pattern, having the area smaller than the area of the part where bonding pads 3 and 31 are directly bonded to a bonding wire, is formed on a silicon nitride film 4. The bonding pad 31, to be connected to the first layer wiring 5, is always covered by the bonding wire 1 completely. Also, a cover film 2 and an isolation film 21 of the material same as the cover film 2 are formed covering the region excluding the part of the bonding pads 3 and 31. Accordingly, when moisture is intruded from outside, the corrosion and the disappearance of a bonding pad do not advance to other bonding pad 31 by the isolation film 21 which stops the corrosion on the part in contact with the bonding pad 3.

Inventors

• 👤 Tetsuya Okuzumi

Bibliographic Details