Resin sealed semiconductor device

Abstract

Abstract PURPOSE:To improve a semiconductor device of this design in a moisture resistant property and prevent it from decreasing in a breakdown strength and its terminal leads from being contaminated due to the migration of metal by a method wherein polyimide resin is formed to cover a lead terminal adjacent to the interface section between a resin sealed section and a non-resin sealed section. CONSTITUTION:A semiconductor device is composed of a semiconductor element mounting section 1, a semiconductor element 2, lead terminals 3, bonding wires 4, a sealing resin 5, and a polyimide series resin layer 6. The lead terminals 3 are reinforced by a tie bar 3a, polyimide series resin is applied through printing onto both faces of the lead terminals 3 adjacent to and along the profile of the resin sealed section 5 indicated by a one-dot chain line and made to be hardened for the formation of the polyimide series resin layer 6 as it covers. The resin layer 6 is made to be into a belt-like film covering spaces between the adjacent lead terminals aid fixes the terminals firmly. Next, the semiconductor element 2 is mounted on a semiconductor mounting section 1 of a lead frame, an electrode of the element is connected with the lead terminals through the intermediary of bonding wires 4, sealing is accomplished using the sealing resing 5, and frame 7 and the tie bar 3a are removed.

Inventors

• 👤 Teru Okunoyama

Bibliographic Details