Compact thermal head

Abstract

Abstract PURPOSE:To reduce the area of a substrate and to enhance the degrees of freedom in running of a thermal transfer ribbon and paper, by mounting the head substrate on a base mount and electrically connecting output terminals of the base mount with leads of the head substrate. CONSTITUTION:A plurality of externally connecting terminals 12 are installed on the lower part of a base mount 1. A heating resistor alignment 20 is formed on a projected part on the upper part of a head substrate 2 to be abutted against a thermal transfer ribbon or a paper. Additionally, a mounting part and a connecting part of the head substrate 2 to the base mount 1 are molded by a resin 32. A glazed layer 22 as a base for projecting the heating resistor alignment is provided with a heating resistor layer 23, leads 24a, 24b made of metal films, and a protective film 25. In this construction, a voltage application between the leads 24a and 24b allows an electric current to flow to the heating resistor layer 23 of an area having no leads and results in the heat generation of this part. On the head substrate itself only the heating resistors can be formed without equipping a drive IC or a flexible cable connection terminal ; thus, the head substrate can be formed remarkably compact in size.

Inventors

• 👤 Hiroaki Onishi

Bibliographic Details